© 2012 Fairchild Semiconductor Corporation

www.fairchildsemi.com

FSL156MRIN • Rev. 1.0.0

4

Absolute Maximum Ratings

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be

operable above the recommended operating conditions and stressing the parts to these levels is not recommended.

In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.

The absolute maximum ratings are stress ratings only.

Symbol

Parameter

Min.

Max.

Unit

650

V

Drain Pin Voltage

650

V

26

V

Feedback Pin Voltage

-

0.3

10.0

V

-

0.3

10.0

V

Drain Current Pulsed

4

A

Continuous Switching Drain Current

(5)

1.90

A

1.27

Single-Pulsed Avalanche Energy

(6)

190

mJ

(7)

1.5

W

Maximum Junction Temperature

150

C

Operating Junction Temperature

(8)

-

40

+125

C

Storage Temperature

-

55

+150

C

ESD

Electrostatic Discharge

Capability

Human Body Model, JESD22-A114

4.5

kV

Charged Device Model, JESD22-C101

2.0

Notes:

5.

junction temperature (see Figure 4).

6.

7.

Infinite cooling condition (refer to the SEMI G30-88).

8.

Although this parameter guarantees IC operation, it does not guarantee all electrical characteristics.

Figure 4.

Repetitive Peak Switching Current

Thermal Impedance

Symbol

Parameter

Value

Unit

Junction-to-Ambient Thermal Impedance

(9)

85

°C/W

Junction-to-Lead Thermal Impedance

(10)

11

°C/W

Notes:

9.

JEDEC recommended environment, JESD51-2, and test board, JESD51-10, with minimum land pattern.

10. Measured on drain pin #7, close to the plastic interface.