Lattice Semiconductor Corporation

(1.31, 30-MAR-2012)

www.latticesemi.com/

2

Ordering Information

Figure 2 describes the iCE40HX ordering codes for all packaged components. See the separate DiePlus data sheets

when ordering die-based products. See the separate iCE40 Pinout Excel files for package and pinout specifications.

Figure 2: iCE40HX Ordering Codes (packaged, non-die components)

High Performance

Series

Logic Cells

Package Style

iCE40HX 8K - CM 225

Package Leads

VQ = Very Thin Quad flat pack (0.5 mm pitch)

TQ = Thin Quad flat pack (0.5 mm pitch)

640, 1K, 4K, 8K

iCE40HX8K-CM225

225-ball Chip-Scale BGA Package

(7x7 mm footprint, 0.4 mm pitch)