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TMDS361B Datasheet(PDF) 8 Page - Texas Instruments |
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TMDS361B Datasheet(HTML) 8 Page - Texas Instruments |
8 / 48 page TMDS361B SLLS988A – SEPTEMBER 2009 – REVISED JULY 2011 www.ti.com Table 2. Control-Pin Lookup Table(1) SIGNAL LEVEL STATE DESCRIPTION Normal operational mode for device. If LP is left floating, then a weak internal pullup to VCC H Normal mode pulls it to VCC. LP Low-power Device is forced into a low-power state, causing the inputs and outputs to go to a L mode high-impedance state. All other inputs are ignored. S2 S1 H H Port 1 Port 1 is selected as the active port; all other ports are low. S[2:1] H L Port 2 Port 2 is selected as the active port; all other ports are low. GPIO L L Port 3 Port 3 is selected as the active port; all other ports are low. mode HPD[1:3] follow L H Standby mode: HPD[1:3] follow HPD_sink. HPD_SINK L I2C Device is configured by I2C logic. I2C_SEL Device is configured by GPIO. If the I2C_SEL pin is left floating, then a weak internal pullup to H GPIO VCC pulls the I2C_SEL pin high. Driver output voltage swing precision control to aid with system compliance. The VSadj Compliant VSadj 4.02 k Ω resistor value can be selected to be 4.02 k Ω ±10% based on the system requirement to pass voltage HDMI compliance. (1) (H) Logic high; (L) Logic low ORDERING INFORMATION(1) PART NUMBER PART MARKING PACKAGE TMDS361BPAGR TMDS361B 64-pin TQFP reel (large) TMDS361BPAG TMDS361B 64-pin TQFP tray (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI Web site at www.ti.com. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) VALUE UNIT Supply voltage range(2) VCC –0.3 to 3.6 V TMDS I/O –0.3 to 4 Voltage range HPD and DDC I/O –0.3 to 5.5 V Control and status I/O –0.3 to 5.5 Human body model(3) on SCL[1:3], SDA[1:3], HPD[1:3], D[0:2]+_[1:3], ±10,000 D[0:2] –_[1:3], CLK+_[1:3], CLK–_[1:3] pins Human body model(3) on all other pins ±9,000 V Charged-device model(4) ±1500 Electrostatic discharge Machine model(5) ±200 IEC 61000-4-2(6), contact discharge ±8,000 IEC 61000-4-2(6), air discharge ±15,000 Continuous power dissipation See Dissipation Ratings table (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values, except differential voltages, are with respect to network ground terminal. (3) Tested in accordance with JEDEC Standard 22, Test Method A114-B (4) Tested in accordance with JEDEC Standard 22, Test Method C101-A (5) Tested in accordance with JEDEC Standard 22, Test Method A115-A (6) Tested in accordance with IEC EN 61000-4-2 8 Copyright © 2009–2011, Texas Instruments Incorporated |
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