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TPS23851DCE Datasheet(PDF) 3 Page - Texas Instruments |
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TPS23851DCE Datasheet(HTML) 3 Page - Texas Instruments |
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3 / 62 page  TPS23851 www.ti.com SLUSAB3 – SEPTEMBER 2010 THERMAL INFORMATION TPS23851 THERMAL METRIC(1) DCE UNITS 36 PINS qJA Junction-to-ambient thermal resistance(2) 52.4 qJCtop Junction-to-case (top) thermal resistance(3) 25.1 qJB Junction-to-board thermal resistance(4) 29.0 °C/W yJT Junction-to-top characterization parameter(5) 3.4 yJB Junction-to-board characterization parameter(6) 26.4 qJCbot Junction-to-case (bottom) thermal resistance(7) n/a (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. (2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as specified in JESD51-7, in an environment described in JESD51-2a. (3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. (4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB temperature, as described in JESD51-8. (5) The junction-to-top characterization parameter, yJT, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining qJA, using a procedure described in JESD51-2a (sections 6 and 7). (6) The junction-to-board characterization parameter, yJB, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining qJA , using a procedure described in JESD51-2a (sections 6 and 7). (7) The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. RECOMMENDED OPERATING CONDITIONS voltages are referenced to DGND (unless otherwise noted) PARAMETER MIN NOM MAX UNIT VVDD 3 3.3 3.5 V VVEE To AGND -44 -48 -57 TJ Operating junction temperature -20 125 °C TA Operating free-air temperature -20 85 Copyright © 2010, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Link(s): TPS23851 |
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