AND8391-D datasheet(2/8 Pages) ONSEMI

Part #	AND8391-D

Description	Thermal Considerations for the ON Semiconductor

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Manufacturer	ONSEMI [ON Semiconductor]

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AND8391/D

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TA, AMBIENT TEMPERATURE (°C)

100

200

300

400

500

600

700

800

−40

−20

0

20

406080

500 mm2 2 oz

500 mm2 1 oz

300 mm2 2 oz

300 mm2 1 oz

100 mm2 2 oz

100 mm2 1 oz

Figure 1. Power Dissipation vs. Ambient

Temperature (SOD−123) @ TJ = 1505C for Variable

Copper Heat Spreader

PD max @ 855C

500 mm2 2 oz Cu

241 mW

500 mm2 1 oz Cu

228 mW

300 mm2 2 oz Cu

189 mW

300 mm2 1 oz Cu

182 mW

100 mm2 2 oz Cu

117 mW

100 mm2 1 oz Cu

108 mW

Figure 2. SOD−123 NSI14030T1G qJA and PD vs. Cu Area

0

200

400

600

800

1000

1200

0

100

200

300

400

500

600

700

0

0.1

0.2

0.3

0.4

0.5

0.6

PCB COPPER AREA (mm2)

Power Curve 2.0 oz Cu

Power Curve 1.0 oz Cu

qJA 1.0 oz Cu

qJA 2.0 oz Cu

TA = 25°C

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AND8391-D Datasheet(PDF) 2 Page - ON Semiconductor

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