8

PG

SW

VOS

FB

Exposed

Thermal

Pad

PGND

VIN

EN

AGND

7

6

5

2

3

1

4

1

2

3

4

8

7

6

5

PGND

VIN

EN

AGND

PG

SW

VOS

FB

TPS62160

TPS62161, TPS62162, TPS62163

SLVSAM2A – NOVEMBER 2011 – REVISED MARCH 2012

www.ti.com

DEVICE INFORMATION

DSG PACKAGE

(TOP VIEW)

DGK PACKAGE

(TOP VIEW)

spacing

Terminal Functions

I/O

DESCRIPTION

NAME

NO.

PGND

1

Power ground

VIN

2

I

Supply voltage

EN

3

I

Enable input (High = enabled, Low = disabled)

AGND

4

Analog Ground

FB

5

I

Voltage feedback of adjustable version. Connect resistive voltage divider to this pin. It is recommended to

connect FB to AGND on fixed output voltage versions for improved thermal performance.

VOS

6

I

Output voltage sense pin and connection for the control loop circuitry.

Switch node, which is connected to the internal MOSFET switches. Connect inductor between SW and

SW

7

O

output capacitor.

PG

8

O

Output power good (High = VOUT ready, Low = VOUT below nominal regulation) ; open drain (requires

pull-up resistor; goes high impedance, when device is switched off)

Exposed

Must be connected to AGND. Must be soldered to achieve appropriate power dissipation and mechanical

Thermal Pad

reliability.

(1)

For more information about connecting pins, see DETAILED DESCRIPTION and APPLICATION INFORMATION sections.

4

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Product Folder Link(s): TPS62160 TPS62161 TPS62162 TPS62163