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TPS65708YZHT Datasheet(PDF) 2 Page - Texas Instruments |
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TPS65708YZHT Datasheet(HTML) 2 Page - Texas Instruments |
2 / 22 page TPS65708 SLVSAE1A – OCTOBER 2010 – REVISED FEBRUARY 2011 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ORDERING INFORMATION SIZE FOR WCSP PACKAGE PACKAGE TA PART NO.(1) OPTIONS PACKAGE VERSION CODE MARKING VDCDC1 = 3.3V VDCDC2 = 1.8V VLDO1 = 2.8V D = 2076 µm ±25 µm –40°C to 85°C TPS65708 VLDO2 = 1.2V YZH WCSP TPS65708 E = 2076 µm ±25 µm ISINK(PWM=1) = 7.5mA SEQUENCING : DCDC1, LDO1, DCDC2, LDO2 (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the device product folder on ti.com, (http://www.ti.com) ABSOLUTE MAXIMUM RATINGS Over operating free-air temperature range (unless otherwise noted). (1) VALUE UNIT MIN MAX all pins except A/PGND pins with respect to –0.3 7 V AGND Voltage range pin VLDO1 and VLDO2 with respect to AGND –0.3 3.6 V L1, L2, VLDO1, VLDO2, PGND 700mA mA Current AGND, ISINK 50mA mA all other pins 3mA mA Operating free-air temperature, TA –40 85 °C Maximum junction temperature, TJ 125 °C Storage temperature, TST –65 150 °C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. THERMAL INFORMATION TPS65708 THERMAL METRIC(1) UNITS YZH (16 Pins) θJA Junction-to-ambient thermal resistance 75 θJCtop Junction-to-case (top) thermal resistance 22 θJB Junction-to-board thermal resistance 26 °C/W ψJT Junction-to-top characterization parameter 0.2 ψJB Junction-to-board characterization parameter 24 θJCbot Junction-to-case (bottom) thermal resistance N/A (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 2 Submit Documentation Feedback © 2010–2011, Texas Instruments Incorporated Product Folder Link(s) :TPS65708 |
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