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TS3A225EYFFR Datasheet(PDF) 1 Page - Texas Instruments

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Part # TS3A225EYFFR
Description  AUTONOMOUS AUDIO HEADSET SWITCH
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

TS3A225EYFFR Datasheet(HTML) 1 Page - Texas Instruments

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S1
VDD
SCL
SDA
I2C_ADDR_SEL
MICp
MICn / HP_REF
SLEEVE_SENSE
RING2_SENSE
SLEEVE
RING2
GND
Control
Logic
TS3A225E
FET2
FET1
TIP
RING1
MIC_BIAS
MICI
MIC_REF
R1
C1
C2
C3
/MIC_PRESENT
DET_TRIGGER
TIP_SENSE
TS3A225E
www.ti.com
SCDS329
– NOVEMBER 2011
AUTONOMOUS AUDIO HEADSET SWITCH
Check for Samples: TS3A225E
1
FEATURES
APPLICATIONS
VDD Range = 2.7 V to 4.5 V
Mobile Phones/ Tablet PCs
Break Before Make Stereo Jack Switches
Notebook Computers
Ground FET Switches (
<100mΩ)
DESCRIPTION
Autonomous Detection of GND and MIC
The TS3A225E is an audio headset switch device.
Connections
The device detects the presence of an analog
Detection Triggered by I2C or External Trigger
microphone
and
switches
a
system
analog
Pin
microphone pin between different connectors in an
audio stereo jack. The microphone connection in a
HDA Compatible MIC Present Indicator
stereo connector can be swapped with the ground
1.8V Compatible I2C Switch Control
connection depending on manufacturer. When the
ESD Performance Tested Per JESD 22:
TAS3A225E detects a certain configuration, the
– 2000-V Human-Body Model (A114-B, Class
device automatically connects the microphone line to
the appropriate pin. The device also reports the
II)
presence of an analog microphone on an audio
– 500-V Charged-Device Model (C101)
stereo jack.
ESD Performance (SLEEVE, RING2, TIP)
In some systems, it is desirable to connect the stereo
– ±8-kV Contact Discharge (IEC 61000-4-2)
jack pin to ground. The TS3A225E provides two
internal low resistance (
<100mΩ) FET switches for
ground shorting.
ORDERING INFORMATION
TA
PACKAGE(1)(2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
–40°C to 85°C
YFF- WCSP
Tape and reel
TS3A225EYFFR
YP225E
–40°C to 85°C
RTE- QFN
Tape and reel
TS3A225ERTER
ZTL
(1)
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright
© 2011, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.


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