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FEATURES

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OFFSET N1

IN-

IN+

V

CC-

OFFSET N2

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CC+

OUT

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DPACKAGE

(TOP VIEW)

DESCRIPTION

TLE2027-EP

Excalibur™ LOW-NOISE HIGH-SPEED

PRECISION OPERATIONAL AMPLIFIER

SLOS511 – JUNE 2007

–

• Controlled Baseline

–

19 V/

–

One Assembly/Test Site, One Fabrication

Site

• Available in Standard-Pinout Small-Outline

Package

• Extended Temperature Performance of

–55

°C to 125°C

• Output Features Saturation Recovery Circuitry

• Enhanced Diminishing Manufacturing Sources

• Macromodels and Statistical information

(DMS) Support

• Enhanced Product-Change Notification

• Outstanding Combination of DC Precision and

AC Performance:

–

Unity-Gain Bandwidth . . . 13 MHz Typ

–

2.5 nV/

√Hz at f = 1 kHz Typ

(1)

Component qualification in accordance with JEDEC and

industry standards to ensure reliable operation over an

extended temperature range. This includes, but is not limited

to, Highly Accelerated Stress Test (HAST) or biased 85/85,

temperature cycle, autoclave or unbiased HAST,

electromigration, bond intermetallic life, and mold compound

life. Such qualification testing should not be viewed as

justifying use of this component beyond specified

performance and environmental limits.

The TLE2027 contains innovative circuit design expertise and high-quality process control techniques to produce

a level of ac performance and dc precision previously unavailable in single operational amplifiers. Manufactured

using TI's state-of-the-art Excalibur process, these devices allow upgrades to systems that use lower-precision

devices.

In the area of dc precision, the TLE2027 offers maximum offset voltages of 100

μV, common-mode rejection

ratio of 131 dB (typ), supply voltage rejection ratio of 144 dB (typ), and dc gain of 45 V/

μV (typ).

The ac performance of the TLE2027 is highlighted by a typical unity-gain bandwidth specification of 15 MHz, 55

°

of phase margin, and noise voltage specifications of 3.3 nV/

√Hz and 2.5 nV/√Hz at frequencies of 10 Hz and

1 kHz, respectively.

The TLE2027 is available in a wide variety of packages, including the industry-standard 8-pin small-outline

version for high-density system applications. The device is characterized for operation over the full military

temperature range of –55

°C to 125°C.

PACKAGED DEVICES

25

°C

–55

°C to 125°C

100

μV

TLE2027MDREP

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

(2)

The D package is available taped and reeled with 2500 units/reel.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

All trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Copyright © 2007, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.