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TLV70018QDDCRQ1 Datasheet(PDF) 11 Page - Texas Instruments

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Part # TLV70018QDDCRQ1
Description  300-mA, Low-IQ, Low-Dropout Regulator
Download  19 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

TLV70018QDDCRQ1 Datasheet(HTML) 11 Page - Texas Instruments

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P =(V
V
)
I
-
´
D
IN
OUT
OUT
TLV70018-Q1
TLV70012-Q1
www.ti.com
SLVSB67A – NOVEMBER 2011 – REVISED MARCH 2012
As with any linear regulator, PSRR and transient
The internal protection circuitry of the TLV70018-Q1
response are degraded as (VIN – VOUT) approaches
has been designed to protect against overload
dropout. This effect is shown in Figure 15 in the
conditions. It was not intended to replace proper
Typical Characteristics section.
heatsinking. Continuously running the TLV70018-Q1
into thermal shutdown degrades device reliability.
TRANSIENT RESPONSE
POWER DISSIPATION
As with any regulator, increasing the size of the
output capacitor reduces over-/undershoot magnitude
The ability to remove heat from the die is different for
but increases the duration of the transient response.
each
package
type,
presenting
different
considerations in the printed circuit board (PCB)
layout. The PCB area around the device that is free
UNDERVOLTAGE LOCKOUT (UVLO)
of other components moves the heat from the device
The TLV70018-Q1 uses an undervoltage lockout
to the ambient air.
circuit to keep the output shut off until internal
Thermal performance data for TLV70018-Q1 were
circuitry is operating properly.
gathered using the TLV700 evaluation module (EVM),
a 2-layer board with two ounces of copper per side.
THERMAL INFORMATION
The dimensions and layout for the SOT23-5 (DBV)
Thermal protection disables the output when the
EVM are shown in Figure 25 and Figure 26.
junction temperature rises to approximately +165°C,
Corresponding thermal performance data are given in
allowing the device to cool. When the junction
Table 1. Note that this board has provision for
temperature cools to approximately +145°C, the
soldering not only the SOT23-5 package on the
output circuitry is again enabled. Depending on power
bottom layer, but also the SC-70 package on the top
dissipation,
thermal
resistance,
and
ambient
layer. Corresponding thermal performance data is
temperature, the thermal protection circuit may cycle
again given in Table 1. Using heavier copper
on and off. This cycling limits the dissipation of the
increases the effectiveness in removing heat from the
regulator, protecting it from damage as a result of
device. The addition of plated through-holes to heat-
overheating.
dissipating
layers
also
improves
heatsink
effectiveness.
Any tendency to activate the thermal protection circuit
indicates
excessive
power
dissipation
or
an
Power dissipation depends on input voltage and load
inadequate heatsink. For reliable operation, junction
conditions. Power dissipation (PD) is equal to the
temperature should be limited to +125°C maximum.
product of the output current and the voltage drop
across the output pass element, as shown in
To estimate the margin of safety in a complete design
Equation 1.
(including
heatsink),
increase
the
ambient
temperature until the thermal protection is triggered;
(1)
use worst-case loads and signal conditions.
PACKAGE MOUNTING
Solder
pad
footprint
recommendations
for
the
TLV70018-Q1
are
available
from
the
Texas
Instruments web site at www.ti.com.
Table 1. EVM Dissipation Ratings
DERATING
PACKAG
FACTOR ABOVE
BOARD
E
RθJC
RθJA
TA = 25°C
TA ≤ 25°C
TA = 70°C
TA = 85°C
TA = 125°C
Low-K(1)
DDC
90°C/W
280°C/W
3.6 mW/°C
360 mW
200 mW
145 mW
51 mW
High-K(2)
DDC
90°C/W
200°C/W
5.0 mW/°C
500 mW
275 mW
200 mW
106 mW
(1)
The JEDEC low-K (1s) board used to derive this data was a 3-inch × 3-inch, two-layer board with 2-ounce copper traces on top of the
board.
(2)
The JEDEC high-K (2s2p) board used to derive this data was a 3-inch × 3-inch, multilayer board with 1-ounce internal power and
ground planes and 2-ounce copper traces on top and bottom of the board.
Copyright © 2011–2012, Texas Instruments Incorporated
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