TPS40210-Q1, TPS40211-Q1

SLVS861D – AUGUST 2008 – REVISED APRIL 2010

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

ORDERABLE

TOP-SIDE

PART NUMBER

MARKING

700 mV

MSOP PowerPAD™ – DGQ

Reel of 2500

TPS40210QDGQRQ1

4210Q

–40°C to 125°C

260 mV

MSOP PowerPAD™ – DGQ

Reel of 2500

TPS40211QDGQRQ1

4211Q

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2)

Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

DEVICE RATINGS

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range unless otherwise noted

(1)

VDD

–0.3 V to 52 V

Input voltage range

RC, SS, FB, DIS/EN

–0.3 V to 10 V

ISNS

–0.3 V to 8 V

Output voltage range

COMP, BP, GDRV

–0.3 V to 9 V

Operating junction temperature range

–40°C to 150°C

Storage temperature range

–55°C to 150°C

(1)

Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

RECOMMENDED OPERATING CONDITIONS

MIN

MAX

UNIT

Input voltage

4.5

52

V

Operating junction temperature

–40

125

°C

PACKAGE DISSIPATION RATINGS

AIRFLOW

(1)

POWER RATING (W)

POWER RATING (W)

PACKAGE

(LFM)

(°C/W)

10-Pin MSOP PowerPAD

0 (Natural Convection)

57.7

1.73

0.693

(DGQ)

(1)

Ratings based on JEDEC high thermal conductivity (High K) board. For more information on the test method, see TI technical brief

SZZA017.

ELECTROSTATIC DISCHARGE (ESD) PROTECTION

TYP

UNIT

Human-Body Model (HBM)

1500

V

Charged-Device Model (CDM)

1500

2

Submit Documentation Feedback

Copyright © 2008–2010, Texas Instruments Incorporated

Product Folder Link(s): TPS40210-Q1 TPS40211-Q1