TPS53219A

SLUSAU4

– DECEMBER 2011

www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ORDERING INFORMATION

ORDERING DEVICE

MINIMUM

TA

PACKAGE

PINS

OUTPUT SUPPLY

ECO PLAN

NUMBER

QUANTITY

TPS53219ARGTR

16

Tape and reel

3000

Green (RoHS and

–40°C to 85°C

Plastic QFN (RGT)

no Pb/Br)

TPS53219ARGTT

16

Mini-reel

250

ABSOLUTE MAXIMUM RATINGS

(1)

over operating free-air temperature range (unless otherwise noted)

VALUE

UNIT

VBST

–0.3 to 37

–0.3 to 7

VDD

–0.3 to 28

Input voltage range

V

DC

–2.0 to 30

SW

Pulse

<20ns, E = 5 µJ

–7

VDRV, EN, TRIP, VFB, RF, MODE

–0.3 to 7

DRVH

–2.0 to 37

–0.3 to 7

Output voltage range

V

DRVL, VREG

–0.5 to 7

PGOOD

–0.3 to 7

Junction temperature range

150

°C

Storage temperature range

–55 to 150

°C

(1)

Stresses beyond those listed under

"absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under

"recommended operating

conditions

" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Voltage values are with respect to the SW terminal

THERMAL INFORMATION

TPS53219A

UNITS

16-PIN RGT

Junction-to-ambient thermal resistance

51.3

Junction-to-case (top) thermal resistance

85.4

Junction-to-board thermal resistance

20.1

°C/W

Junction-to-top characterization parameter

1.3

Junction-to-board characterization parameter

19.4

Junction-to-case (bottom) thermal resistance

6.0

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

2

Submit Documentation Feedback

Copyright

© 2011, Texas Instruments Incorporated

Product Folder Link(s) :TPS53219A