TPS54394

SLVSBE6 – JUNE 2012

www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ORDERING PART NUMBER

PINS

OUTPUT SUPPLY

TPS54394PWPR

Tape-and-Reel

–40

℃ to 85℃

PWP

16

TPS54394PWP

Tube

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com

(2)

Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

(3)

All packaging options have Cu NIPDAU lead/ball finish.

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range (unless otherwise noted)

(1) (2)

VALUE

UNIT

VIN1, VIN2, EN1, EN2

–0.3 to 20

VBST1, VBST2

–0.3 to 26

VBST1, VBST2 (10ns transient)

–0.3 to 28

Input voltage range

VBST1–SW1 , VBST2–SW2

–0.3 to 6.5

V

VFB1, VFB2

–0.3 to 6.5

SW1, SW2

–2 to 20

SW1, SW2 (10ns transient)

–3 to 22

VREG5, PG1, PG2

–0.3 to 6.5

Output voltage range

V

PGND1, PGND2

–0.3 to 0.3

Human Body Model (HBM)

2

kV

Electrostatic discharge

Charged Device Model (CDM)

500

V

Operating ambient temperature range

–40 to 85

°C

Storage temperature range

–55 to 150

°C

Junction temperature range

–40 to 150

°C

(1)

Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions" are not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to IC GND terminal.

THERMAL INFORMATION

TPS54394

UNITS

PWP (16) PINS

Junction-to-ambient thermal resistance

47.5

Junction-to-case (top) thermal resistance

27.1

Junction-to-board thermal resistance

20.8

°C/W

Junction-to-top characterization parameter

1.0

Junction-to-board characterization parameter

20.6

Junction-to-case (bottom) thermal resistance

2.7

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

2

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