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SST39SF010A-70-4I-NH Datasheet(PDF) 7 Page - Silicon Storage Technology, Inc |
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SST39SF010A-70-4I-NH Datasheet(HTML) 7 Page - Silicon Storage Technology, Inc |
7 / 22 page Preliminary Specification 1 Mbit / 2 Mbit / 4 Mbit Multi-Purpose Flash SST39SF010A / SST39SF020A / SST39SF040 7 ©2001 Silicon Storage Technology, Inc. S71147-02-000 5/01 398 TABLE 4: SOFTWARE COMMAND SEQUENCE Command Sequence 1st Bus Write Cycle 2nd Bus Write Cycle 3rd Bus Write Cycle 4th Bus Write Cycle 5th Bus Write Cycle 6th Bus Write Cycle Addr1 Data Addr1 Data Addr1 Data Addr1 Data Addr1 Data Addr1 Data Byte-Program 5555H AAH 2AAAH 55H 5555H A0H BA2 Data Sector-Erase 5555H AAH 2AAAH 55H 5555H 80H 5555H AAH 2AAAH 55H SAX3 30H Chip-Erase 5555H AAH 2AAAH 55H 5555H 80H 5555H AAH 2AAAH 55H 5555H 10H Software ID Entry4,5 5555H AAH 2AAAH 55H 5555H 90H Software ID Exit6 XXH F0H Software ID Exit6 5555H AAH 2AAAH 55H 5555H F0H T4.2 398 1. Address format A14-A0 (Hex), Addresses A15 - AMS can be VIL or VIH, but no other value, for the Command sequence. 2. BA = Program Byte address 3. SAX for Sector-Erase; uses AMS-A12 address lines AMS = Most significant address AMS = A16 for SST39SF010A, A17 for SST39SF020A, and A18 for SST39SF040 4. The device does not remain in Software Product ID Mode if powered down. 5. With AMS-A1 =0; SST Manufacturer’s ID= BFH, is read with A0 = 0, SST39SF010A Device ID = B5H, is read with A0 = 1 SST39SF020A Device ID = B6H, is read with A0 = 1 SST39SF040 Device ID = B7H, is read with A0 = 1 6. Both Software ID Exit operations are equivalent Absolute Maximum Stress Ratings (Applied conditions greater than those listed under “Absolute Maximum Stress Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these conditions or conditions greater than those defined in the operational sections of this data sheet is not implied. Exposure to absolute maximum stress rating conditions may affect device reliability.) Temperature Under Bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55°C to +125°C Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to +150°C D. C. Voltage on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to VDD + 0.5V Transient Voltage (<20 ns) on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . -1.0V to VDD + 1.0V Voltage on A9 Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 13.2V Package Power Dissipation Capability (Ta = 25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0W Through Hold Lead Soldering Temperature (10 Seconds) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C Surface Mount Lead Soldering Temperature (3 Seconds) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 240°C Output Short Circuit Current1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA 1. Outputs shorted for no more than one second. No more than one output shorted at a time. OPERATING RANGE Range Ambient Temp VDD Commercial 0°C to +70°C5.0V±10% Industrial -40°C to +85°C5.0V±10% AC CONDITIONS OF TEST Input Rise/Fall Time . . . . . . . . . . . . . . 5 ns Output Load . . . . . . . . . . . . . . . . . . . . . CL = 30 pF for 45 ns Output Load . . . . . . . . . . . . . . . . . . . . . CL = 100 pF for 70 ns See Figures 13 and 14 |
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