SST39SF512-70-4C-WH datasheet(7/22 Pages) SST

Part #	SST39SF512-70-4C-WH

Description	512 Kbit / 1 Mbit (x8) Multi-Purpose Flash

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Manufacturer	SST [Silicon Storage Technology, Inc]

Direct Link	http://www.sst.com/

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7 / 22 page

Data Sheet

512 Kbit / 1 Mbit Multi-Purpose Flash

SST39SF512 / SST39SF010

7

S71149-03-000

4/01

394

TABLE

4: SOFTWARE COMMAND SEQUENCE

Command

Sequence

1st Bus

Write Cycle

2nd Bus

Write Cycle

3rd Bus

Write Cycle

4th Bus

Write Cycle

5th Bus

Write Cycle

6th Bus

Write Cycle

Addr1

Data

Addr1

Data

Addr1

Data

Addr1

Data

Addr1

Data

Addr1

Data

Byte-Program

5555H

AAH

2AAAH

55H

5555H

A0H

BA2

Data

Sector-Erase

5555H

AAH

2AAAH

55H

5555H

80H

5555H

AAH

2AAAH

55H

SAX3

30H

Chip-Erase

5555H

AAH

2AAAH

55H

5555H

80H

5555H

AAH

2AAAH

55H

5555H

10H

Software ID Entry4,5

5555H

AAH

2AAAH

55H

5555H

90H

Software ID Exit6

XXH

F0H

Software ID Exit6

5555H

AAH

2AAAH

55H

5555H

F0H

T4.3 394

1. Address format A14-A0 (Hex), Address A15 can be VIL or VIH, but no other value, for the Command sequence for SST39SF512.

Addresses A15 - A16 can be VIL or VIH, but no other value, for the Command sequence for

SST39SF010.

2. BA = Program Byte address

3. SAX for Sector-Erase; uses AMS-A12 address lines

AMS = Most significant address

AMS = A15 for SST39SF512 and A16 for SST39SF010

4. The device does not remain in Software Product ID Mode if powered down.

5. With AMS-A1 =0;

SST Manufacturer’s ID= BFH, is read with A0 = 0,

SST39LF/VF512 Device ID = B4H, is read with A0 = 1

SST39LF/VF010 Device ID = B5H, is read with A0 = 1

6. Both Software ID Exit operations are equivalent

Absolute Maximum Stress Ratings (Applied conditions greater than those listed under “Absolute Maximum

Stress Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation

of the device at these conditions or conditions greater than those defined in the operational sections of this data

sheet is not implied. Exposure to absolute maximum stress rating conditions may affect device reliability.)

Temperature Under Bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55°C to +125°C

Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to +150°C

D. C. Voltage on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to VDD + 0.5V

Transient Voltage (<20 ns) on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . -1.0V to VDD + 1.0V

Voltage on A9 Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 14.0V

Package Power Dissipation Capability (Ta = 25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0W

Through Hold Lead Soldering Temperature (10 Seconds) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C

Surface Mount Lead Soldering Temperature (3 Seconds) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 240°C

Output Short Circuit Current1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA

1. Outputs shorted for no more than one second. No more than one output shorted at a time.

OPERATING RANGE

Range

Ambient Temp

VDD

Commercial

0°C to +70°C5.0V±10%

Industrial

-40°C to +85°C5.0V±10%

AC CONDITIONS OF TEST

Input Rise/Fall Time . . . . . . . . . . . . . . 10 ns

Output Load . . . . . . . . . . . . . . . . . . . . . CL = 30 pF for 70 ns

Output Load . . . . . . . . . . . . . . . . . . . . . CL = 100 pF for 90 ns

See Figures 13 and 14

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