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QFNPACKAGE

(TOP VIEW)

16 15 14 13

12

11

10

9

5

6

7

8

1

2

3

4

PGND

PGND

CHG

XFULL

SW

SW

VCC

F_ON

Power

PAD

TPS65562

SLVS775 – JUNE 2007

TERMINAL FUNCTIONS

TERMINAL

I/O

DESCRIPTION

NAME

NO.

SW

1, 2

O

Primary side switch. Connect SW to the switched side of the transformer

Power supply input. Connect VCC to an input supply from 2.7 V to 4.0 V. Bypass VCC to GND

VCC

3

I

with a 1

μF ceramic capacitor as close as possible to the IC.

G_IGBT control input. Drives F_ON with the flash discharge signal. A logic high on F_ON drives

F_ON

4

I

G_IGBT high when CHG is Low. See the IGBT driver control section for details.

Primary side Peak current control input. The voltage at I_PEAK sets the peak current into SW.

I_PEAK

5

I

G_IGBT

6

O

IGBT gate driver output. G_IGBT swings from PGND to VCC to drive external IGBT devices.

NC

7, 13, 16

No internal connection

Power supply input for IGBT Driver output. Connect IGBT_VCC to an input supply from 2.7 V to

IGBT_VCC

8

I

5.5 V.

Charge completion indicator output. XFULL is an open-drain output that pulls low once the output

XFULL

9

O

is fully charged. XFULL is high impedance during charging and all fault conditions. XFULL is reset

when CHG turns Low from High. See the Indicating Charging status section for details.

Charge control input. Drive CHG high to initiate charging of the output. Drive CHG low to

CHG

10

I

terminate charging.

PGND

11, 12

Power ground. Connect to the ground plane.

TEST_GND

14

Used by TI, should be connected to PGND and ground plane.

Battery voltage monitor input. Connect VBAT to an input supply from 1.6 V to 12 V. Bypass VBAT

to GND with a 10

μF ceramic capacitor (C1 in Figure 1 as close as possible to the battery) and a

VBAT

15

I

1

μF ceramic capacitor (C2 in Figure 1, as close as possible to the IC). It is no problem to input

VBAT before VCC input.

4

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