Electronic Components Datasheet Search |
|
TPS73601MDRBREP Datasheet(PDF) 4 Page - Texas Instruments |
|
|
TPS73601MDRBREP Datasheet(HTML) 4 Page - Texas Instruments |
4 / 27 page ABSOLUTE MAXIMUM RATINGS POWER DISSIPATION RATINGS (1) TPS73601-EP, TPS73615-EP, TPS73618-EP TPS73625-EP, TPS73630-EP, TPS73632-EP, TPS73633-EP SGLS326C – APRIL 2006 – REVISED FEBRUARY 2009 .................................................................................................................................................. www.ti.com over operating free-air temperature range unless otherwise noted (1) UNIT VIN range –0.3 to 6 V VEN range –0.3 to 6 V VOUT range –0.3 to 5.5 V Peak output current Internally limited Output short-circuit duration Indefinite Continuous total power dissipation See Dissipation Ratings Table Junction temperature range, TJ –55 to 150 °C Storage temperature range –65 to 150 °C Human-Body Model - HBM 2 kV ESD rating Charged-Device Model - CDM 500 V (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under the Electrical Characteristics is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability. DERATING FACTOR TA ≤ 25°C TA = 70°C TA = 85°C BOARD PACKAGE RθJC RθJA ABOVE TA = 25°C POWER RATING POWER RATING POWER RATING Low-K(2) DBV 64°C/W 255°C/W 3.9 mW/°C 392 mW 216 mW 157 mW High-K(3) DBV 64°C/W 180°C/W 5.6 mW/°C 556 mW 306 mW 222 mW Low-K(2) DCQ 15°C/W 53°C/W 18.9 mW/°C 1887 mW 1038 mW 755 mW High-K(3) DCQ 15°C/W 45°C/W 22.2 mW/°C 2222 mW 1222 mW 889 mW High-K(3)(4) DRB 1.2°C/W 40°C/W 25.0 mW/°C 2500 mW 1375 mW 1000 mW (1) See the Thermal Protection section for more information related to thermal design. (2) The JEDEC Low-K (1s) board design used to derive this data was a 3 in × 3 in, two-layer board with 2 oz copper traces on top of the board. (3) The JEDEC High-K (2s2p) board design used to derive this data was a 3 in × 3 in, multilayer board with 1 oz internal power and ground planes, and 2-oz copper traces on the top and bottom of the board. (4) Based on preliminary thermal simulations. 4 Submit Documentation Feedback Copyright © 2006–2009, Texas Instruments Incorporated Product Folder Link(s): TPS73601-EP TPS73615-EP TPS73618-EP TPS73625-EP TPS73630-EP TPS73632-EP TPS73633-EP |
Similar Part No. - TPS73601MDRBREP |
|
Similar Description - TPS73601MDRBREP |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.NET |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |