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TPS73430DRBR Datasheet(PDF) 10 Page - Texas Instruments |
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TPS73430DRBR Datasheet(HTML) 10 Page - Texas Instruments |
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10 / 20 page  Thermal Information Thermal Protection Power Dissipation P D + VIN*VOUT @ IOUT (2) Package Mounting TPS734xx SBVS089F – DECEMBER 2007 – REVISED FEBRUARY 2009 ........................................................................................................................................ www.ti.com Thermal protection disables the output when the The ability to remove heat from the die is different for junction temperature rises to approximately +165°C, each package type, presenting different allowing the device to cool. When the junction considerations in the PCB layout. The PCB area temperature cools to approximately +145°C the around the device that is free of other components output circuitry is again enabled. Depending on power moves the heat from the device to the ambient air. dissipation, thermal resistance, and ambient Performance data for JEDEC low- and high-K boards temperature, the thermal protection circuit may cycle are given in the Dissipation Ratings table. Using on and off. This cycling limits the dissipation of the heavier copper increases the effectiveness in regulator, protecting it from damage as a result of removing heat from the device. The addition of plated overheating. through-holes to heat-dissipating layers also improves the heatsink effectiveness. Any tendency to activate the thermal protection circuit indicates excessive power dissipation or an Power dissipation depends on input voltage and load inadequate heatsink. For reliable operation, junction conditions. Power dissipation is equal to the product temperature should be limited to +125°C maximum. of the output current time the voltage drop across the To estimate the margin of safety in a complete design output pass element, as shown in Equation 2: (including heatsink), increase the ambient temperature until the thermal protection is triggered; use worst-case loads and signal conditions. For good reliability, thermal protection should trigger at least +35°C above the maximum expected ambient Solder pad footprint recommendations for the condition of your particular application. This TPS734xx are available from the Texas Instruments configuration produces a worst-case junction web site at www.ti.com. temperature of +125°C at the highest expected ambient temperature and worst-case load. The internal protection circuitry of the TPS734xx has been designed to protect against overload conditions. It was not intended to replace proper heatsinking. Continuously running the TPS734xx into thermal shutdown degrades device reliability. 10 Submit Documentation Feedback Copyright © 2007–2009, Texas Instruments Incorporated |
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