TXB0304

SCES831C – SEPTEMBER 2011 – REVISED MAY 2012

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

ORDERABLE PART NUMBER

TOP-SIDE MARKING

RUT – MicroQFN

TXB0304RUTR

73R

RSV – QFN

TXB0304RSVR

ZTJ

–40 to 85°C

RUT – MicroQFN

TXBN0304RUTR

74R

RSV – QFN

TXBN0304RSVR

ZTK

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2)

Package drawings, thermal data, and symbolization are available at www.ti.com.

DEVICE INFORMATION

Table 1. SIGNAL DESCRIPTIONS

PIN NO.

NAME

FUNCTION

RSV

RUT

TXB0304

TXBN0304

16

1

A-port supply voltage 0.9V

1

2

A1

Input/output 1

2

3

A2

Input/output 2

3

4

A3

Input/output 3

4

5

A4

Input/output 4

5

–

NC

No connection; not internally connected

6,7

6

GND

Ground

3-state output-mode enable. Pull OE (TXB0304) low to place all outputs in 3-state mode.

3-state output-mode enable. Pull OE (TXBN0304) high to place all outputs in 3-state

8

12

OE

OE

mode.

Referenced to VCCA.

9

7

B4

Input/output 1

10

8

B3

Input/output 2

11

9

B2

Input/output 3

12

10

B1

Input/output 4

13

11

B-port supply voltage 0.9V

14

–

NC

No connection; not internally connected

15

–

NC

No connection; not internally connected

2

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