PACKAGE OPTION ADDENDUM

www.ti.com

9-May-2012

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device

Status

(1)

Package Type Package

Drawing

Pins

Package Qty

Eco Plan

(2)

Lead/

Ball Finish

MSL Peak Temp

(3)

Samples

(Requires Login)

5962-8670405VPA

ACTIVE

CDIP

JG

8

1

TBD

A42

N / A for Pkg Type

Add to cart

5962-8670405VXA

ACTIVE

LCCC

FK

20

1

TBD

POST-PLATE N / A for Pkg Type

Add to cart

5962-8670406VPA

ACTIVE

CDIP

JG

8

1

TBD

A42

N / A for Pkg Type

Add to cart

5962-8670406VXA

ACTIVE

LCCC

FK

20

1

TBD

POST-PLATE N / A for Pkg Type

Add to cart

5962-8670407VPA

ACTIVE

CDIP

JG

8

1

TBD

A42

N / A for Pkg Type

Add to cart

5962-8670407VXA

ACTIVE

LCCC

FK

20

1

TBD

POST-PLATE N / A for Pkg Type

Add to cart

5962-8670408VPA

ACTIVE

CDIP

JG

8

1

TBD

A42

N / A for Pkg Type

Add to cart

5962-8670408VXA

ACTIVE

LCCC

FK

20

1

TBD

POST-PLATE N / A for Pkg Type

Add to cart

5962-8670409VPA

ACTIVE

CDIP

JG

8

1

TBD

A42

N / A for Pkg Type

Add to cart

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.