TLV810M, TLV810R

TLV810S, TLV810Z

SBVS158A

– APRIL 2011 – REVISED JUNE 2011

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

SPECIFIED

THRESHOLD

PACKAGE-

PACKAGE

OPERATING

PACKAGE

ORDERING

TRANSPORT MEDIA,

PRODUCT

VOLTAGE

LEAD

DESIGNATOR

TEMPERATURE

MARKING

INFORMATION

QUANTITY

TLV810ZDBZR

Tape and Reel, 3000

TLV810Z

2.25 V

SOT23-3

DBZ

–40°C to +125°C

VOVQ

TLV810ZDBZT

Tape and Reel, 250

TLV810RDBZR

Tape and Reel, 3000

TLV810R

2.64 V

SOT23-3

DBZ

–40°C to +125°C

VOWQ

TLV810RDBZT

Tape and Reel, 250

TLV810SDBZR

Tape and Reel, 3000

TLV810S

2.93 V

SOT23-3

DBZ

–40°C to +125°C

VOXQ

TLV810SDBZT

Tape and Reel, 250

TLV810MDBZR

Tape and Reel, 3000

TLV810M

4.38 V

SOT23-3

DBZ

–40°C to +125°C

VOYQ

TLV810MDBZT

Tape and Reel, 250

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet, or visit the

device product folders at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

(1)

Over operating free-air temperature range (unless otherwise noted).

VALUE

MIN

MAX

UNIT

(2)

0

7

V

Voltage

–0.3

7

V

5

mA

–5

mA

Current

±20

mA

±20

mA

–40

+125

°C

Temperature

–65

+150

°C

Soldering temperature

+260

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to GND. For reliable operation the device should not be operated at 7 V for more than t = 1000h

continuously.

THERMAL INFORMATION

TLV810

DBZ

UNITS

3 PINS

Junction-to-ambient thermal resistance

286.9

Junction-to-case (top) thermal resistance

105.6

Junction-to-board thermal resistance

124.4

°C/W

Junction-to-top characterization parameter

25.8

Junction-to-board characterization parameter

107.9

Junction-to-case (bottom) thermal resistance

—

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

2

Copyright

© 2011, Texas Instruments Incorporated