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Chip Silicon Rectifier

Formosa MS

SFM11-MH THRU SFM18-MH

http://www.formosams.com/

TEL:886-2-22696661

FAX:886-2-22696141

Document ID

Issued Date

Revised Date

Revision

Page.

SOD-123H

7"

3,000

4.0

30,000

183*183*123

178

382*262*387

240,000

8.5

PACKAGE

REEL SIZE

REEL

COMPONENT

SPACING

BOX

INNER

BOX

REEL

DIA,

CARTON

SIZE

CARTON

APPROX.

GROSS WEIGHT

(kg)

(pcs)

(m/m)

(m/m)

(m/m)

(pcs)

(m/m)

(pcs)

Reel packing

Profile Feature

Soldering Condition

<3

/sec

Preheat

o

-Temperature Min(Tsmin)

150 C

o

-Temperature Max(Tsmax)

200 C

60~120sec

o

-Ramp-upRate

<3 C/sec

Time maintained above:

o

217 C

60~260sec

o

o

255 C-0/+5 C

o

Time within 5 C of actual Peak

o

Ramp-down Rate

<6 C/sec

o

Time 25 C to Peak Temperature

<6minutes

3.Reflow soldering

10~30sec

1.Storage environment: Temperature=5

~40

Humidity=55%±25%

2.Reflow soldering of surface-mount devices

o

o

C

C

Suggested thermal profiles for soldering processes

Critical Zone

TL to TP

TL

Tsmax

Tsmin

Ramp-up

Tp

tS

Preheat

o

t25 C to Peak

Time

25

TL

TP

Ramp-down

DS-121402

2008/02/10

2010/11/10

D

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