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HVC1206T5006GET Datasheet(PDF) 1 Page - Ohmite Mfg. Co. |
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HVC1206T5006GET Datasheet(HTML) 1 Page - Ohmite Mfg. Co. |
1 / 2 page 1 1600 Golf Rd., Rolling Meadows, IL 60008 • 1-866-9-OHMITE • Int’l 1-847-258-0300 • Fax 1-847-574-7522 • www.ohmite.com Serie S Specification S Wattage1 Oper. Voltage (V) Resistance TCR2 VCR2 Series Type P70 (mW) std. untrimmed ( ≥5%) Range Tolerance (ppm) (ppm) HVC0805--- 0805 125 200 400 100K-100M 0.5-10% 25, 50, 100 100 >100M-1G 2-20% 50, 100, 250 250 >1G-10G 5-20% 250, 500 500 >10G-100G 10-30% 2000 1000 HVC1206--- 1206 250 600 1000 100K-100M 0.5-10% 25, 50, 100 50 >100M-1G 2-20% 50, 100, 250 100 >1G-10G 5-20% 100, 250 250 >10G-100G 10-30% 500, 1000 1000 HVC2512--- 2512 1000 2000 3000 100K-100M 0.5-10% 25, 50, 100 10 >100M-1G 1-20% 25, 50, 100 25 >1G-10G 2-20% 50, 100 50 >10G-100G 5-30% 250, 500 100 1. At continuous power dissipation the dimensions of the solder pads have to be capable of sufficient heat conduction. 2. Not all TCR/VCR combinations available in all resistance values characteri S tic S Operating temperature range -55°C ~ +155°C Climatic category 55/155/56, acc. to EN 60068-1 Solderability 250°C, 3s, acc. to EN 60068-2-58 Max. soldering temperature 260°C, 10s, acc. to IEC 68-2-58 Long Term Stability <1G <10G ≥10G Load Life 70°C/1000h <0.25% <0.5% <1% Storage 125°C/1000h <0.5% <1% <2% Max. Voltage/1000h <0.5% <1% <2% Data not specified according to EN 140401-802 (CECC 40401-802) THICK FILM SMD hVc Series Precision High-Value High-voltage Wraparound Chip f ea ture S •Highvaluechipresistorsinthickfilmtechnology •Lowtemperatureandvoltagedependency(lowTCRandVCR) •Highworkingvoltageupto3000V •Suitableforhighvacuumapplications—noorganics •Contactareas:Nickel-barrier/mattetin •Wraparoundterminals 100 Ambient Temperature, °C 60 20 0 80 40 050 100 155 70 -55 Derating t erminal Detail S Base Metal PtAg Termination Finish 100% electroplated matte Sn100 Thickness of Finish 5 microns Barrier Material between Base Metal and Finish Porosity-free Ni (5-8 microns thickness) Baking/Annealing Process after Sn Plating 150°C; > 4 hours Peak Process Body Temperature (Classification Temperature) and Maximum Time 260°C for 10 seconds |
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