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HVC1206T1004KET Datasheet(PDF) 1 Page - Ohmite Mfg. Co.

Part # HVC1206T1004KET
Description  Precision High-Value High-voltage Wraparound Chip
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Manufacturer  OHMITE [Ohmite Mfg. Co.]
Direct Link  http://www.ohmite.com
Logo OHMITE - Ohmite Mfg. Co.

HVC1206T1004KET Datasheet(HTML) 1 Page - Ohmite Mfg. Co.

  HVC1206T1004KET Datasheet HTML 1Page - Ohmite Mfg. Co. HVC1206T1004KET Datasheet HTML 2Page - Ohmite Mfg. Co.  
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1 1600 Golf Rd., Rolling Meadows, IL 60008 • 1-866-9-OHMITE • Int’l 1-847-258-0300 • Fax 1-847-574-7522 • www.ohmite.com
Serie S Specification S
Wattage1
Oper. Voltage (V)
Resistance
TCR2
VCR2
Series
Type
P70 (mW)
std. untrimmed (
≥5%)
Range
Tolerance
(ppm)
(ppm)
HVC0805---
0805
125
200
400
100K-100M
0.5-10%
25, 50, 100
100
>100M-1G
2-20%
50, 100, 250
250
>1G-10G
5-20%
250, 500
500
>10G-100G
10-30%
2000
1000
HVC1206---
1206
250
600
1000
100K-100M
0.5-10%
25, 50, 100
50
>100M-1G
2-20%
50, 100, 250
100
>1G-10G
5-20%
100, 250
250
>10G-100G
10-30%
500, 1000
1000
HVC2512---
2512
1000
2000
3000
100K-100M
0.5-10%
25, 50, 100
10
>100M-1G
1-20%
25, 50, 100
25
>1G-10G
2-20%
50, 100
50
>10G-100G
5-30%
250, 500
100
1. At continuous power dissipation the dimensions of the solder pads have to be capable of sufficient heat conduction.
2. Not all TCR/VCR combinations available in all resistance values
characteri S tic S
Operating temperature
range
-55°C ~ +155°C
Climatic category 55/155/56, acc. to EN 60068-1
Solderability 250°C, 3s, acc. to EN 60068-2-58
Max. soldering temperature 260°C, 10s, acc. to IEC 68-2-58
Long Term Stability
<1G
<10G
≥10G
Load Life 70°C/1000h <0.25% <0.5% <1%
Storage 125°C/1000h <0.5%
<1%
<2%
Max. Voltage/1000h
<0.5%
<1%
<2%
Data not specified according to EN 140401-802 (CECC 40401-802)
THICK FILM
SMD
hVc Series
Precision High-Value High-voltage Wraparound Chip
f ea ture S
•Highvaluechipresistorsinthickfilmtechnology
•Lowtemperatureandvoltagedependency(lowTCRandVCR)
•Highworkingvoltageupto3000V
•Suitableforhighvacuumapplications—noorganics
•Contactareas:Nickel-barrier/mattetin
•Wraparoundterminals
100
Ambient Temperature,
°C
60
20
0
80
40
050
100
155
70
-55
Derating
t erminal Detail S
Base Metal PtAg
Termination Finish 100% electroplated matte Sn100
Thickness of Finish 5 microns
Barrier Material between Base Metal and Finish Porosity-free Ni (5-8 microns thickness)
Baking/Annealing Process after Sn Plating 150°C; > 4 hours
Peak Process Body Temperature (Classification
Temperature) and Maximum Time
260°C for 10 seconds


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