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TSOP57456 Datasheet(PDF) 7 Page - Vishay Siliconix |
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TSOP57456 Datasheet(HTML) 7 Page - Vishay Siliconix |
7 / 11 page TSOP572.., TSOP574.. www.vishay.com Vishay Semiconductors Rev. 1.5, 20-Jun-12 7 Document Number: 82434 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 ASSEMBLY INSTRUCTIONS Reflow Soldering • Reflow soldering must be done within 168 h while stored under a max. temperature of 30 °C, 60 % RH after opening the dry pack envelope • Set the furnace temperatures for pre-heating and heating in accordance with the reflow temperature profile as shown in the diagram. Excercise extreme care to keep the maximum temperature below 260 °C. The temperature shown in the profile means the temperature at the device surface. Since there is a temperature difference between the component and the circuit board, it should be verified that the temperature of the device is accurately being measured • Handling after reflow should be done only after the work surface has been cooled off Manual Soldering • Use a soldering iron of 25 W or less. Adjust the temperature of the soldering iron below 300 °C • Finish soldering within 3 s • Handle products only after the temperature has cooled off VISHAY LEAD (Pb)-FREE REFLOW SOLDER PROFILE Note (1) MOQ: minimum order quantity ORDERING INFORMATION ORDERING CODE PACKAGING VOLUME (1) REMARKS TSOP57..TT1 Tape and reel MOQ: 1800 pcs 3.95 mm x 3.95 mm x 0.75 mm TSOP57..TT2 MOQ: 7000 pcs 0 50 100 150 200 250 300 0 50 100 150 200 250 300 t (s) 255 °C 240 °C 245 °C max. 260 °C max. 120 s max. 100 s 217 °C max. 20 s max. Ramp Up 3 °C/s max. Ramp Down 6 °C/s max. 2 cycles allowed 19800 |
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