CXA1875AP datasheet(10/10 Pages) SONY

Part #	CXA1875AP

Description	8-bit D/A Converter Compatible with I2C Bus

Download	10 Pages

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Manufacturer	SONY [Sony Corporation]

Direct Link	http://www.sony.co.jp

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10 / 10 page

PACKAGE STRUCTURE

PACKAGE MATERIAL

LEAD TREATMENT

LEAD MATERIAL

PACKAGE MASS

EPOXY RESIN

SOLDER PLATING

COPPER ALLOY

19.2 – 0.1

+ 0.4

9

1

8

2.54

0.5 ± 0.1

1.2 ± 0.15

0° to 15°

16

16PIN DIP (PLASTIC)

1.0 g

SONY CODE

EIAJ CODE

JEDEC CODE

DIP-16P-01

DIP016-P-0300

Similar to MO-001-AE

1.All mat surface type.

Two kinds of package surface:

2.All mirror surface type.

PACKAGE STRUCTURE

PACKAGE MATERIAL

LEAD TREATMENT

LEAD MATERIAL

PACKAGE MASS

SONY CODE

EIAJ CODE

JEDEC CODE

SOP-16P-L01

SOP016-P-0300

COPPER ALLOY

SOLDER PLATING

EPOXY RESIN

16PIN SOP (PLASTIC)

9.9 – 0.1

+ 0.4

16

9

1

8

1.27

0.45 ± 0.1

1.85 – 0.15

+ 0.4

0.2 – 0.05

+ 0.1

0.1 – 0.05

+ 0.2

0.2g

0.15

M

0.24

Package Outline

Unit : mm

CXA1875AP

CXA1875AM

CXA1875AP/AM

—10—

Purchase of Sony’s I2C components conveys a license under the Philips I2C Patent Rights to use these components in an I2C

system, provided that the system conforms to the I2C Standard Specifications as defined by Philips.

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CXA1875AP Datasheet(PDF) 10 Page - Sony Corporation

CXA1875AP Datasheet(HTML) 10 Page - Sony Corporation

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