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CXA2039M Datasheet(PDF) 11 Page - Sony Corporation |
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CXA2039M Datasheet(HTML) 11 Page - Sony Corporation |
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11 / 11 page  – 11 – CXA2039M Sony Corporation Package Outline Unit: mm SONY CODE EIAJ CODE JEDEC CODE M PACKAGE STRUCTURE MOLDING COMPOUND LEAD TREATMENT LEAD MATERIAL PACKAGE WEIGHT EPOXY/PHENOL RESIN SOLDER PLATING COPPER ALLOY / 42ALLOY 24PIN SOP (PLASTIC) 15.0 – 0.1 + 0.4 112 13 24 1.27 0.45 ± 0.1 0.2 – 0.05 + 0.1 0.1 – 0.05 + 0.2 0.15 1.85 – 0.15 + 0.4 ± 0.12 SOP-24P-L01 ∗SOP024-P-0300-A 0.3g LEAD PLATING SPECIFICATIONS ITEM LEAD MATERIAL COPPER ALLOY SOLDER COMPOSITION Sn-Bi Bi:1-4wt% PLATING THICKNESS 5-18 µm SPEC. |
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