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AN10897 Datasheet(PDF) 2 Page - NXP Semiconductors

Part # AN10897
Description  A guide to designing for ESD and EMC
Download  30 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

AN10897 Datasheet(HTML) 2 Page - NXP Semiconductors

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AN10897_2
© NXP B.V. 2010. All rights reserved.
Application note
Rev. 02 — 19 January 2010
2 of 30
Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NXP Semiconductors
AN10897
A guide to designing for ESD and EMC
Revision history
Rev
Date
Description
02
20100119
application note; second release
Modifications:
Title of application note modified: appended “and EMC”
• Section 2.3.5 “Filters”, 1st bullet item, 2nd sub-bullet: changed from “high filter capacitors”
to “high speed capacitors”
• Section 2.3.6 “Ground”, 2nd equation following 3rd paragraph changed from
“V = 20
× 10e−9 × (10A/10e−9)” to “V = 20 nH × (10A/10ns)”
• Section 3.1 “Board structure - functional grouping”: 3rd paragraph re-written.
• Section 3.1.1.1 “4-layer board stack-up”, 2nd sentence: changed from “use a wide core”
to “use a thick core”.
• Figure 18 “Recommended stack-ups” modified (adjusted height of stack-up layers)
• Section 3.1.2 “Ground planes”:
– deleted 3rd and 4th bullet items following the 3rd paragraph.
– 4th paragraph (immediately follows Figure 23) was re-written (now 4th, 5th and 6th
paragraphs).
• Figure 26 “Ground island and vias” modified (added label “vias to ground” on left side).
• Figure 31 “Ground plane boundary” modified (added “20 × layer spacing” measurement)
01
20091214
application note; initial version


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