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MMBZ52xxBLT3G Datasheet(PDF) 1 Page - ON Semiconductor |
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MMBZ52xxBLT3G Datasheet(HTML) 1 Page - ON Semiconductor |
1 / 6 page Semiconductor Components Industries, LLC, 2012 February, 2012 − Rev. 11 1 Publication Order Number: MMBZ5221BLT1/D MMBZ52xxBLT1G Series, SZMMBZ52xxBLT1G Series Zener Voltage Regulators 225 mW SOT−23 Surface Mount This series of Zener diodes is offered in the convenient, surface mount plastic SOT−23 package. These devices are designed to provide voltage regulation with minimum space requirement. They are well suited for applications such as cellular phones, hand held portables, and high density PC boards. Features 225 mW Rating on FR−4 or FR−5 Board Zener Voltage Range − 2.4 V to 91 V Package Designed for Optimal Automated Board Assembly Small Package Size for High Density Applications ESD Rating of Class 3 (> 16 KV) per Human Body Model SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable Pb−Free Packages are Available* Mechanical Characteristics CASE: Void-free, transfer-molded, thermosetting plastic case FINISH: Corrosion resistant finish, easily solderable MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260C for 10 Seconds POLARITY: Cathode indicated by polarity band FLAMMABILITY RATING: UL 94 V−0 MAXIMUM RATINGS Rating Symbol Max Units Total Power Dissipation on FR−5 Board, (Note 1) @ TA = 25C Derated above 25C PD 225 1.8 mW mW/C Thermal Resistance, Junction−to−Ambient RqJA 556 C/W Total Power Dissipation on Alumina Substrate, (Note 2) @ TA = 25C Derated above 25C PD 300 2.4 mW mW/C Thermal Resistance, Junction−to−Ambient RqJA 417 C/W Junction and Storage Temperature Range TJ, Tstg −65 to +150 C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. FR−5 = 1.0 X 0.75 X 0.62 in. 2. Alumina = 0.4 X 0.3 X 0.024 in, 99.5% alumina. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Device Package Shipping† ORDERING INFORMATION SOT−23 CASE 318 STYLE 8 3 Cathode 1 Anode MARKING DIAGRAM See specific marking information in the device marking column of the Electrical Characteristics table on page 3 of this data sheet. DEVICE MARKING INFORMATION MMBZ52xxBLT1G SOT−23 (Pb−Free) 3,000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. MMBZ52xxBLT3G SOT−23 (Pb−Free) 10,000 / Tape & Reel http://onsemi.com xxx G G xxx = Specific Device Code M = Date Code G = Pb−Free Package SZMMBZ52xxBLT1G SOT−23 (Pb−Free) 3,000 / Tape & Reel SZMMBZ52xxBLT3G SOT−23 (Pb−Free) 10,000 / Tape & Reel (Note: Microdot may be in either location) |
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