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MMBZ5255ELT3G Datasheet(PDF) 1 Page - ON Semiconductor |
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MMBZ5255ELT3G Datasheet(HTML) 1 Page - ON Semiconductor |
1 / 6 page © Semiconductor Components Industries, LLC, 2011 December, 2011 − Rev. 7 1 Publication Order Number: MMBZ5221ELT1/D MMBZ52xxELT1G Series, SZMMBZ52xxELT1G Series Zener Voltage Regulators 225 mW SOT−23 Surface Mount This series of Zener diodes is offered in the convenient, surface mount plastic SOT−23 package. These devices are designed to provide voltage regulation with minimum space requirement. They are well suited for applications such as cellular phones, hand held portables, and high density PC boards. Features • 225 mW Rating on FR−4 or FR−5 Board • Zener Voltage Range − 2.4 V to 91 V • Package Designed for Optimal Automated Board Assembly • Small Package Size for High Density Applications • ESD Rating of Class 3 (>16 kV) per Human Body Model • Peak Power − 225 W (8 x 20 ms) • AEC−Q101 Qualified and PPAP Capable • SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements • Pb−Free Packages are Available Mechanical Characteristics: CASE: Void-free, transfer-molded, thermosetting plastic case FINISH: Corrosion resistant finish, easily solderable MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260 °C for 10 Seconds POLARITY: Cathode indicated by polarity band FLAMMABILITY RATING: UL 94 V−0 MAXIMUM RATINGS Rating Symbol Max Unit Peak Power Dissipation @ 20 ms (Note 1) @ TL ≤ 25°C Ppk 225 W Total Power Dissipation on FR−5 Board, (Note 2) @ TA = 25°C Derated above 25°C PD 225 1.8 mW mW/°C Thermal Resistance, Junction−to−Ambient RqJA 556 °C/W Total Power Dissipation on Alumina Substrate, (Note 3) @ TA = 25°C Derated above 25°C PD 300 2.4 mW mW/°C Thermal Resistance, Junction−to−Ambient RqJA 417 °C/W Junction and Storage Temperature Range TJ, Tstg −65 to +150 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Nonrepetitive current pulse per Figure 9. 2. FR−5 = 1.0 X 0.75 X 0.62 in. 3. Alumina = 0.4 X 0.3 X 0.024 in., 99.5% alumina. 3 Cathode 1 Anode See specific marking information in the device marking column of the Electrical Characteristics table on page 2 of this data sheet. DEVICE MARKING INFORMATION http://onsemi.com SOT−23 CASE 318 STYLE 8 MARKING DIAGRAM 1 3 2 1 Bxx M G G Bxx = Device Code xx = (Refer to page 2) M = Date Code* G = Pb−Free Package (Note: Microdot may be in either location) *Date Code orientation may vary depending upon manufacturing location. Device Package Shipping† ORDERING INFORMATION MMBZ52xxELT3G SOT−23 (Pb−Free) 10000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. MMBZ52xxELT1G SOT−23 (Pb−Free) 3000 / Tape & Reel SZMMBZ52xxELT1G SOT−23 (Pb−Free) 3000 / Tape & Reel |
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