MUN5231DW1, NSBC123EDXV6

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2

THERMAL CHARACTERISTICS

Characteristic

Symbol

Max

Unit

MUN5231DW1 (SOT−363) ONE JUNCTION HEATED

Total Device Dissipation

(Note 1)

(Note 2)

Derate above 25C

(Note 1)

(Note 2)

187

256

1.5

2.0

mW

mW/C

Thermal Resistance,

(Note 1)

Junction to Ambient

(Note 2)

670

490

C/W

MUN5231DW1 (SOT−363) BOTH JUNCTION HEATED (Note 3)

Total Device Dissipation

(Note 1)

(Note 2)

Derate above 25C

(Note 1)

(Note 2)

250

385

2.0

3.0

mW

mW/C

Thermal Resistance,

Junction to Ambient

(Note 1)

(Note 2)

493

325

C/W

Thermal Resistance,

Junction to Lead

(Note 1)

(Note 2)

188

208

C/W

Junction and Storage Temperature Range

−55 to +150

C

NSBC123EDXV6 (SOT−563) ONE JUNCTION HEATED

Total Device Dissipation

(Note 1)

Derate above 25C

(Note 1)

357

2.9

mW

mW/C

Thermal Resistance,

Junction to Ambient

(Note 1)

350

C/W

NSBC123EDXV6 (SOT−563) BOTH JUNCTION HEATED (Note 3)

Total Device Dissipation

(Note 1)

Derate above 25C

(Note 1)

500

4.0

mW

mW/C

Thermal Resistance,

Junction to Ambient

(Note 1)

250

C/W

Junction and Storage Temperature Range

−55 to +150

C

1. FR−4 @ Minimum Pad.

2. FR−4 @ 1.0  1.0 Inch Pad.

3. Both junction heated values assume total power is sum of two equally powered channels.