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NBVSPA013LNHTAG Datasheet(PDF) 6 Page - ON Semiconductor |
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NBVSPA013LNHTAG Datasheet(HTML) 6 Page - ON Semiconductor |
6 / 7 page NBVSPA013 http://onsemi.com 6 Table 8. RELIABILITY COMPLIANCE Parameter Standard Method Shock Mechanical MIL−STD−833, Method 2002, Condition B Solderability Mechanical MIL−STD−833, Method 2003 Vibration Mechanical MIL−STD−833, Method 2007, Condition A Solvent Resistance Mechanical MIL−STD−202, Method 215 Thermal Shock Environment MIL−STD−833, Method 1011, Condition A Moisture Level Sensitivity Environment MSL1 260°C per IPC/JEDEC J−STD−020D Figure 4. Typical Termination for Output Driver and Device Evaluation Driver Device Receiver Device CLK D CLK D Zo = 50 W Zo = 50 W 100 W NBVSPA013 260 217 175 150 Temperature (°C) temp. 260°C 20 − 40 sec. max. Time 60180 sec. 3°C/sec. max. cooling 6°C/sec. max. 60150 sec. reflow peak pre−heat ramp−up Figure 5. Recommended Reflow Soldering Profile Table 9. ORDERING INFORMATION Device Output Frequency (MHz) Package Shipping† 5.0 x 7.0 x 1.8 mm NBVSPA013LN1TAG 212.0000 CLCC−6, Pb−Free 1000 / Tape & Reel NBVSPA013LNHTAG 212.0000 CLCC−6, Pb−Free 100 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and Reel Packaging Specification Brochure, BRD8011/D |
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