MC74VHC244

http://onsemi.com

2

FUNCTION TABLE

INPUTS

OUTPUTS

OEA, OEB

A, B

YA, YB

L

L

L

L

H

H

H

X

Z

ORDERING INFORMATION

Device

Package

MC74VHC244DW − OBSOLETE*

SOIC−20 WB

38 Units/Rail

MC74VHC244DWR2G

SOIC−20 WB

(Pb−Free)

1000/Tape & Reel

MC74VHC244DTG

TSSOP−20

(Pb−Free)

75 Units/Rail

MC74VHC244DTR2G

TSSOP−20

(Pb−Free)

2500/Tape & Reel

MC74VHC244M − OBSOLETE*

SOIC EIAJ−20

(Pb−Free)

1600 Units/Box

MC74VHC244MELG

SOIC EIAJ−20

(Pb−Free)

2000/Tape & Reel

*This device is obsolete, information available for reference.

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

Symbol

Parameter

Value

Unit

Positive DC Supply Voltage

−0.5 to +7.0

V

Digital Input Voltage

−0.5 to +7.0

V

DC Output Voltage

V

Input Diode Current

−20

mA

Output Diode Current

$20

mA

DC Output Current, per Pin

$25

mA

$75

mA

Power Dissipation in Still Air

SOIC

TSSOP

500

450

mW

Storage Temperature Range

−65 to +150

°C

ESD Withstand Voltage

Human Body Model (Note 2)

Machine Model (Note 3)

Charged Device Model (Note 4)

>2000

>200

>2000

V

Latchup Performance

$300

mA

Thermal Resistance, Junction−to−Ambient

SOIC

TSSOP

96

128

°C/W

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

2. Tested to EIA/JESD22−A114−A

3. Tested to EIA/JESD22−A115−A

4. Tested to JESD22−C101−A

5. Tested to EIA/JESD78