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B72500D0050H160 Datasheet(PDF) 9 Page - EPCOS |
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B72500D0050H160 Datasheet(HTML) 9 Page - EPCOS |
9 / 22 page 1 Taping and packing for chip and array CeraDiodes 1.1 Cardboard tape (taping to IEC 60286-3) Dimensions in mm Case size (inch) 0201 0402 0603 1003 0508 Tolerance (mm) 0603 1005 1608 2508 1220 Compartment width A0 0.38 ±0.05 0.6 0.95 1.0 1.6 ±0.2 Compartment length B0 0.68 ±0.05 1.15 1.8 2.85 2.4 ±0.2 Sprocket hole diameter D0 1.5 ±0.1 1.5 1.5 1.5 1.5 +0.1/ 0 Sprocket hole pitch P0 4.0 ±0.11) 4.0 4.0 4.0 4.0 ±0.11) Distance center hole to center compartment P2 2.0 ±0.05 2.0 2.0 2.0 2.0 ±0.05 Pitch of component compartments P1 2.0 ±0.05 2.0 4.0 4.0 4.0 ±0.1 Tape width W 8.0 ±0.3 8.0 8.0 8.0 8.0 ±0.3 Distance edge to center of hole E 1.75 ±0.1 1.75 1.75 1.75 1.75 ±0.1 Distance center hole to center compartment F 3.5 ±0.05 3.5 3.5 3.5 3.5 ±0.05 Distance compartment to edge G 1.35 min. 0.75 0.75 0.75 0.75 min. Thickness tape T 0.35 ±0.02 0.6 0.9 1.0 0.95 max. Overall thickness T2 0.4 min. 0.7 1.1 1.1 1.12 max. 1) ≤ ±0.2 mm over 10 sprocket holes CeraDiodes High-speed series Page 9 of 22 Please read Cautions and warnings and Important notes at the end of this document. |
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