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IS31BL3229 Datasheet(PDF) 9 Page - Integrated Silicon Solution, Inc |
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IS31BL3229 Datasheet(HTML) 9 Page - Integrated Silicon Solution, Inc |
9 / 11 page IS31BL3229 Integrated Silicon Solution, Inc. – www.issi.com 9 Rev.A, 09/17/2012 THERMAL PROTECTION The IS31BL3229 has a thermal protection circuit that will shut down the chip if the die temperature rises above the thermal limit until the temperature falls down. DESIGN NOTE The decoupling capacitors should be placed close to the VCC pin. A 0.1μF ceramic and an 1μF capacitors are recommended. The flying capacitor should be placed close to the CN and CP pins. The output capacitor should be placed close to the OUT pin and the traces of OUT pin connected to the capacitor should be as possible as short and wide. Trace width should be at least 0.75mm when the current reaches 1A. Trace width should be at least 1.0mm for the power supply and the ground plane. The thermal pad and the GND pin should connect directly to a strong common ground plane for heat sinking. |
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