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TLBF1108A Datasheet(PDF) 6 Page - Toshiba Semiconductor |
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TLBF1108A Datasheet(HTML) 6 Page - Toshiba Semiconductor |
6 / 12 page TLBF1108A(T11 6 10. 10. 10. 10. Mounting Method Mounting Method Mounting Method Mounting Method 10.1. 10.1. 10.1. 10.1. Precautions when Mounting Precautions when Mounting Precautions when Mounting Precautions when Mounting • Do not apply force to the plastic part of the LED under high-temperature conditions. • To avoid damaging the LED plastic, do not apply friction using a hard material. • When installing the PCB in a product, ensure that the device does not come into contact with other cmponents. • For this product, silicone is used as the encapsulated material. Therefore the top surface of this product is soft. Please do not stress on the encapsulated part of LEDs to avoid affecting the reliability of the product. When using the mounting devices, please use the picking up nozzle that does not affect the silicone resin. 10.2. 10.2. 10.2. 10.2. Soldering Soldering Soldering Soldering Following show examples of reflow soldering. • Temperature Profile (see following figures.) Fig. Fig. Fig. Fig. 10.2.1 10.2.1 10.2.1 10.2.1 Temperature Profile for Pb Soldering Temperature Profile for Pb Soldering Temperature Profile for Pb Soldering Temperature Profile for Pb Soldering (Example) (Example) (Example) (Example) Fig. Fig. Fig. Fig. 10.2.2 10.2.2 10.2.2 10.2.2 Temperature Profile for Lead(Pb)-free Temperature Profile for Lead(Pb)-free Temperature Profile for Lead(Pb)-free Temperature Profile for Lead(Pb)-free Soldering (Example) Soldering (Example) Soldering (Example) Soldering (Example) • The product is evaluated using above reflow soldering conditions. No additional test is performed exceed the condition (i.e. the condition more than (*)MAX values) as a evaluation. Please perform reflow soldering under the above conditions. • Please perform the first reflow soldering with reference to the above temperature profile and within 4 weeks of opening the package. • If a second reflow process is necessary, reflow soldering should be performed within 168 hours of the first reflow under the above conditions. Storage conditions before the second reflow soldering: 30, 60% RH (max) • Do not perform wave soldering. • Manual soldering with a soldering iron should meet the following conditions: Temperature at tip of iron: 300 (max) Soldering iron capacity: 25 W Time: 3 seconds (max) (only once at each soldering point) 2012-02-24 Rev.2.0 |
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