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TMP87PM41NG Datasheet(PDF) 3 Page - Toshiba Semiconductor |
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TMP87PM41NG Datasheet(HTML) 3 Page - Toshiba Semiconductor |
3 / 22 page TMP87PM41 II 2008-03-06 1. Part number 2. Package code and dimensions Previous Part Number (in Body Text) Previous Package Code (in Body Text) New Part Number New Package Code OTP TMP87PM41N P-SDIP64-750-1.78 TMP87PM41NG SDIP64-P-750-1.78 — TMP87PM41F P-QFP64-1420-1.00A TMP87PM41FG QFP64-P-1420-1.00A — TMP87PM41U P-LQFP64-1010-0.50D TMP87PM41UG LQFP64-P-1010-0.50D — *: For the dimensions of the new package, see the attached Package Dimensions diagram. 3. Addition of notes on lead solderability The following solderability test is conducted on the new device. Lead solderability of Pb-free devices (with the G suffix) Test Test Conditions Remark Solderability (1) Use of Lead (Pb) · solder bath temperature = 230°C · dipping time = 5 seconds · the number of times = once · use of R-type flux (2) Use of Lead (Pb)-Free · solder bath temperature = 245°C · dipping time = 5 seconds · the number of times = once · use of R-type flux Leads with over 95% solder coverage till lead forming are acceptable. |
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