Setup

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2

Setup

This section describes the connectors and headers on the EVM as well as how to properly connect, setup

and use the TPS7A4700EVM-094. See the Assembly Layer diagram, Figure 5, for the location and

orientation of referenced components.

2.1

Input/Output Connector-Headers and Jumper Descriptions

•

J1 V

•

J2 GND – Ground and measurement header

•

J3 V

•

J4 GND – Ground return from the load (up to 1 Amp)

•

J5 (S+) – V

•

J5 (S–) – GRD, Kelvin connection Ground

•

J6 & J7 – Extra GRD connections

•

J8 – Enable jumper for external resistor divider

•

J9 – Enable jumper for the TPS7A4700-094 EVM

•

J10 – Header for selecting the appropriate output voltage

NOTE:

The positive input lead and ground return lead from the input power supply should be twisted

and kept as short as possible to minimize EMI and source inductance. Additional bulk

capacitance in the form of a Tantalum cap (47 µF; 35 V) has been added to the EVM at C1

to counter source inductances that may cause ringing on the load transient waveform during

higher current transients. This bulk capacitance should not be necessary in a typical

application circuit.

Output Voltage Set Note: Set the output voltage by connecting J10 header pins, each

assigned to a given voltage level, to ground where V

voltages). J10 header pins are numbered sequentially, odd pins (1, 3, 5...15) ascending

leftward of pin 1 on the top row. All odd pins are connected to ground. Each even pin is

numbered right to left sequentially (2, 4, 6…16) on the bottom row and each even pin is

assigned a unique voltage level. See the pin-to-pin output voltage assignments in Table 1.

Table 1. J10 Jumper Voltages

V

Voltage Level

Voltage Set Pins

Ground Pins

100 mV

16

15

200 mV

14

13

400 mV

12

11

800 mV

10

9

1.6 V

8

7

3.2 V

6

5

6.4 V

4

3

6.4 V

2

1

(1)

See the data sheet for V

Example: Set V

V

2.2

Soldering Guidelines

Any solder rework to modify the EVM for the purpose of repair or other application reasons must be

performed using a hot-air system to avoid damaging the integrated circuit (IC).

2

TPS7A4700EVM-094 Evaluation Module

SLVU741 – May 2012

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