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ADC08D502CIYB Datasheet(PDF) 11 Page - Texas Instruments |
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ADC08D502CIYB Datasheet(HTML) 11 Page - Texas Instruments |
11 / 43 page ADC08D502 www.ti.com SNOSC85 – AUGUST 2012 Converter Electrical Characteristics (continued) The following specifications apply after calibration for VA = VDR = +1.9VDC, OutV = 1.9V, VIN FSR (a.c. coupled) = differential 870mVP-P, CL = 10 pF, Differential, a.c. coupled Sinewave Input Clock, fCLK = 500 MHz at 0.5VP-P with 50% duty cycle, VBG = Floating, Non-Extended Control Mode, SDR Mode, REXT = 3300Ω ±0.1%, Analog Signal Source Impedance = 100Ω Differential. Boldface limits apply for TA = TMIN to TMAX. All other limits TA = 25°C, unless otherwise noted. (1) (2) Typical Limits Units Symbol Parameter Conditions (3) (3) (Limits) CHANNEL-TO-CHANNEL CHARACTERISTICS Offset Error Match 1 LSB Positive Full-Scale Error Match Zero offset selected in Control Register 1 LSB Negative Full-Scale Error Match Zero offset selected in Control Register 1 LSB Phase Matching (I, Q) FIN = 1.0 GHz < 1 Degree Crosstalk from I (Aggressor) to Q Aggressor = 867 MHz F.S. X-TALK −71 dB (Victim) Channel Victim = 100 MHz F.S. Crosstalk from Q (Aggressor) to I Aggressor = 867 MHz F.S. X-TALK -71 dB (Victim) Channel Victim = 100 MHz F.S. CLOCK INPUT CHARACTERISTICS 0.4 VP-P (min) Sine Wave Clock 0.6 2.0 VP-P (max) VID Differential Clock Input Level 0.4 VP-P (min) Square Wave Clock 0.6 2.0 VP-P (max) II Input Current VIN = 0 or VIN = VA ±1 µA Differential 0.02 pF CIN Input Capacitance (7) (8) Each input to ground 1.5 pF DIGITAL CONTROL PIN CHARACTERISTICS VIH Logic High Input Voltage (9) 0.85 x VA V (min) VIL Logic Low Input Voltage (9) 0.15 x VA V (max) CIN Input Capacitance (10) (11) Each input to ground 1.2 pF DIGITAL OUTPUT CHARACTERISTICS 400 mVP-P (min) Measured differentially, OutV = VA, 710 VBG = Floating, (12) 920 mVP-P (max) VOD LVDS Differential Output Voltage 280 mVP-P (min) Measured differentially, OutV = GND, 510 VBG = Floating, (12) 720 mVP-P (max) Change in LVDS Output Swing Δ VO DIFF ±1 mV Between Logic Levels VOS Output Offset Voltage, see Figure 1 VBG = Floating 800 mV VOS Output Offset Voltage, see Figure 1 VBG = VA (12) 1200 mV Output Offset Voltage Change Δ VOS ±1 mV Between Logic Levels IOS Output Short Circuit Current Output+ & Output- connected to 0.8V −4 mA ZO Differential Output Impedance 100 Ohms VOH Cal_Run High level output IOH = -400uA (13) 1.65 1.5 V VOL Cal_Run Low level output IOH = 400uA (13) 0.15 0.3 V POWER SUPPLY CHARACTERISTICS (7) The analog and clock input capacitances are die capacitances only. Additional package capacitances of 0.65 pF differential and 0.95 pF each pin to ground are isolated from the die capacitances by lead and bond wire inductances. (8) This parameter is guaranteed by design and is not tested in production. (9) This parameter is guaranteed by design and/or characterization and is not tested in production. (10) This parameter is guaranteed by design and is not tested in production. (11) The digital control pin capacitances are die capacitances only. Additional package capacitance of 1.6 pF each pin to ground are isolated from the die capacitances by lead and bond wire inductances. (12) Tying VBG to the supply rail will increase the output offset voltage (VOS) by 400mv (typical), as shown in the VOS specification above. Tying VBG to the supply rail will also affect the differential LVDS output voltage (VOD), causing it to increase by 40mV (typical). (13) This parameter is guaranteed by design and/or characterization and is not tested in production. Copyright © 2012, Texas Instruments Incorporated Submit Documentation Feedback 11 Product Folder Links: ADC08D502 |
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