© 2009 Fairchild Semiconductor Corporation

www.fairchildsemi.com

FT7521 • Rev. 1.0.7

7

Physical Dimensions

Figure 6.

6-Lead, MicroPak™ 1.0 x 1.45 mm, JEDEC MO-252

Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner

without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or

obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the

warranty therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

2. DIMENSIONS ARE IN MILLIMETERS

1. CONFORMS TO JEDEC STANDARD M0-252 VARIATION UAAD

4. FILENAME AND REVISION: MAC06AREV4

Notes:

3. DRAWING CONFORMS TO ASME Y14.5M-1994

TOP VIEW

RECOMMENED

LAND PATTERN

BOTTOM VIEW

1.45

1.00

A

B

0.05 C

0.05 C

2X

2X

0.55MAX

0.05 C

(0.49)

(1)

(0.75)

(0.52)

(0.30)

6X

1X

6X

PIN 1

DETAIL A

0.075 X 45

CHAMFER

0.25

0.15

0.35

0.25

0.40

0.30

0.5

(0.05)

1.0

5X

DETAIL A

PIN 1 TERMINAL

0.40

0.30

0.45

0.35

0.10

0.00

0.10

CB A

0.05

C

C

0.05 C

0.05

0.00

5X

5X

6X

(0.13)

4X

6X

PIN 1 IDENTIFIER

(0.254)

5. PIN ONE IDENTIFIER IS 2X LENGTH OF ANY

5

OTHER LINE IN THE MARK CODE LAYOUT.