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FAN3227CMX Datasheet(PDF) 2 Page - Fairchild Semiconductor |
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FAN3227CMX Datasheet(HTML) 2 Page - Fairchild Semiconductor |
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2 / 24 page  © 2012 Fairchild Semiconductor Corporation www.fairchildsemi.com FAN3226 / FAN3227 / FAN3228 / FAN3229_F085 • Rev. 1.0.0 2 Ordering Information Part Number Logic Input Threshold Package Eco Status Packing Method Quantity per Reel FAN3226CMX_F085 Dual Inverting Channels + Dual Enable CMOS SOIC-8 RoHS Tape & Reel 2,500 FAN3226TMX_F085 TTL SOIC-8 RoHS Tape & Reel 2,500 FAN3227CMX_F085 Dual Non-Inverting Channels + Dual Enable CMOS SOIC-8 RoHS Tape & Reel 2,500 FAN3227TMX_F085 TTL SOIC-8 RoHS Tape & Reel 2,500 FAN3228CMX_F085 Dual Channels of Two-Input / One-Output Drivers, Pin Configuration 1 CMOS SOIC-8 RoHS Tape & Reel 2,500 FAN3228TMX_F085 TTL SOIC-8 RoHS Tape & Reel 2,500 FAN3229CMX_F085 Dual Channels of Two-Input / One-Output Drivers, Pin Configuration 2 CMOS SOIC-8 RoHS Tape & Reel 2,500 FAN3229TMX_F085 TTL SOIC-8 RoHS Tape & Reel 2,500 For Fairchild’s definition of “green” Eco Status, please visit: http://www.fairchildsemi.com/company/green/rohs_green.html. Package Outline Figure 2. SOIC-8 (Top View) Thermal Characteristics(1) Package JL (2) JT (3) JA (4) JB (5) JT (6) Units 8-Pin Small Outline Integrated Circuit (SOIC) 40 31 89 43 3.0 °C/W Notes: 1. Estimates derived from thermal simulation; actual values depend on the application. 2. Theta_JL ( JL): Thermal resistance between the semiconductor junction and the bottom surface of all the leads (including any thermal pad) that are typically soldered to a PCB. 3. Theta_JT ( JT): Thermal resistance between the semiconductor junction and the top surface of the package, assuming it is held at a uniform temperature by a top-side heatsink. 4. Theta_JA ( ΘJA): Thermal resistance between junction and ambient, dependent on the PCB design, heat sinking, and airflow. The value given is for natural convection with no heatsink, as specified in JEDEC standards JESD51-2, JESD51-5, and JESD51-7, as appropriate. 5. Psi_JB ( JB): Thermal characterization parameter providing correlation between semiconductor junction temperature and an application circuit board reference point for the thermal environment defined in Note 4. For the SOIC-8 package, the board reference is defined as the PCB copper adjacent to pin 6. 6. Psi_JT ( JT): Thermal characterization parameter providing correlation between the semiconductor junction temperature and the center of the top of the package for the thermal environment defined in Note 4. |
Similar Part No. - FAN3227CMX_12 |
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Similar Description - FAN3227CMX_12 |
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