© 2001 Fairchild Semiconductor Corporation

www.fairchildsemi.com

NC7SZ74 • Rev. 1.0.2

7

Physical Dimensions

Figure 9. 8-Lead US8, JEDEC MO-187, Variation CA 3.1mm Wide

Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner

without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or

obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the

warranty therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

Tape and Reel Specifications

Please visit Fairchild Semiconductor’s online packaging area for the most recent tape and reel specifications:

Package Designator

Tape Section

Cavity Number

Cavity Status Cover Type Status

K8X

Leader (Start End)

125 (Typical)

Empty

Sealed

Carrier

3000

Filled

Sealed

Trailer (Hub End)

75 (Typical)

Empty

Sealed

SIDE VIEW

TOP VIEW

RECOMMENDED LAND PATTERN

A

B

0.50

SEATING PLANE

0.10-0.18

0.13

AB

C

0.50

DETAIL A

0.4 TYP

ALL LEAD TIPS

0.2 C B A

PIN 1 IDENT

ALL LEAD TIPS

0.1 C

8

1

4

5

(8X) 0.70

2.70 3.40

1.00

DETAIL A

1.80

GAGE PLANE

0.12

C. DIMENSIONS ARE EXCLUSIVE OF BURRS,

D. DIMENSIONS AND TOLERANCES PER

MOLD FLASH, AND TIE BAR EXTRUSIONS.

B. DIMENSIONS ARE IN MILLIMETERS.

A. CONFORMS TO JEDEC REGISTRATION MO-187

ANSI Y14.5M, 1994.

2.10

1.90

2.40

2.20

0.15

3.20

3.00

1.55

0.90 MAX

0.10

0.00

0.80

0.60

0.30 (8X)

0.20-0.35

0°-8°

C

SEATING

PLANE

E. FILE DRAWING NAME : MKT-MAB08Arev4