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ILX548K

Notes of Handling

1) Static charge prevention

CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following

protective measures.

a) Either handle bare handed or use non chargeable gloves, clothes or material.

Also use conductive shoes.

b) When handling directly use an earth band.

c) Install a conductive mat on the floor or working table to prevent the generation of static electricity.

d) Ionized air is recommended for discharge when handling CCD image sensor.

e) For the shipment of mounted substrates, use boxes treated for prevention of static charges.

2) Notes on Handling CCD Packages

The following points should be observed when handling and installing packages.

a) Remain within the following limits when applying static load to the package:

(1) Compressive strength: 39N/surface (Do not apply load more than 0.7mm inside the outer perimeter

of the glass portion.)

(2) Shearing strength: 29N/surface

(3) Tensile strength: 29N/surface

(4) Torsional strength: 0.9Nm

b) In addition, if a load is applied to the entire surface by a hard component, bending stress may be

generated and the package may fracture, etc., depending on the flatness of the ceramic portion.

Therefore, for installation, either use an elastic load, such as a spring plate, or an adhesive.

c) Be aware that any of the following can cause the package to crack or dust to be generated.

(1) Applying repetitive bending stress to the external leads.

(2) Applying heat to the external leads for an extended period of time with soldering iron.

(3) Rapid cooling or heating.

(4) Rapid cooling or impact to a limited portion of the low-melting glass with a small-tipped tool such as

tweezers.

(5) Prying the upper or lower ceramic layers away at a support point of the low-melting glass.

(6) Prying the plastic portion and ceramic portion away at a support point of the adhesive layer.

(7) Applying the metal a crash or a rub against the plastic portion.

Note that the preceding notes should also be observed when removing a component from a board after

it has already been soldered.

39N

Lower ceramic layer

Upper ceramic layer

Low-melting glass

(1)

29N

(3)

0.9Nm

(4)

29N

(2)

Plastic portion

Cover glass

39N

Ceramic portion

Adhesive

(1)

29N

(3)

0.9Nm

(4)

29N

(2)