RT8223A/B

11

DS8223A/B-04 April 2011

www.richtek.com

Parameter

Symbol

Test Conditions

Min

Typ

Max

Unit

Logic Input

Low Level (Internal Fixed VOUTx)

--

--

0.2

FB1/FB2 Input Voltage

High Level (Internal Fixed VOUTx)

4.5

--

--

V

Low Level (DEM Mode)

--

--

0.8

REF Level (PWM Mode)

1.8

--

2.3

SKIPSEL Input Voltage

High Level (Ultrasonic Mode)

2.7

--

--

V

Low Level (SMPSs Off)

--

--

0.35

On Level (SMPSs On)

0.5

--

2

ENTRIPx Input Voltage

High Level (SMPSs Off)

4.5

--

--

V

Shutdown

--

--

0.4

Enable

2.4

--

--

EN Voltage

Open

2.4

3.3

4.2

V

1

3

5

EN Current

--

3

8

μA

Shutdown

--

--

0.6

ENC Threshold Voltage

(RT8223B)

Enable

2

--

--

V

--

--

0.8

1.8

--

2.3

TONSEL Setting Voltage

2.7

--

--

V

TONSEL, SKIPSEL = 0V or 5V

−1

--

1

Input Leakage Current

ENC = 0V or 5V (RT8223B)

−1

--

1

μA

Internal BOOT Switch

Internal Boost Charging

Switch On-Resistance

VREG5 to BOOTx

--

20

--

Ω

Power MOSFET Drivers

UGATEx, High state

--

3

6

UGATEx On-Resistance

UGATEx, Low state

--

1.5

4

LGATEx, High State

--

2.2

5

LGATEx On-Resistance

LGATEx, Low State

--

0.6

1.5

Ω

LGATEx Rising

--

30

--

Dead Time

UGATEx Rising

--

40

--

ns

Note 1. Stresses listed as the above "Absolute Maximum Ratings" may cause permanent damage to the device. These are for

stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the

operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended

periods may remain possibility to affect device reliability.

Note 2.

JEDEC 51-7 thermal measurement standard. The measurement case positions of

package and the expose pad for the SOP(Exposed Pad) package.

Note 3. Devices are ESD sensitive. Handling precaution is recommended.

Note 4. The device is not guaranteed to function outside its operating conditions.