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W24258Q-70LE Datasheet(PDF) 8 Page - Winbond

Part # W24258Q-70LE
Description  32K X 8 CMOS STATIC RAM
Download  11 Pages
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Manufacturer  WINBOND [Winbond]
Direct Link  http://www.winbond.com
Logo WINBOND - Winbond

W24258Q-70LE Datasheet(HTML) 8 Page - Winbond

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W24258
- 8 -
BONDING PAD DIAGRAM
1
2
3
4
5
8
11
12
13
15
16
17
18
22
23
24
25
26
27
21
X
Y
A1
4
A1
2
A7
A6
A5
A
3
A2
A0
I/O1 I/O2 I/O3 VSS VSS
I/O3 I/O6 I/O7
19
A10
OE
A11
A9
A8
WE
VDD
VDD
6
7
9
A1
10
A4
20
CS
A13
28
S-2
28
S-1
14
S-1
14
S-2
I/O8
I/O4
PAD NO.
X
Y
1
-276.73
2047.90
2
-421.97
2047.90
3
-568.93
2047.90
4
-714.17
2047.90
5
-861.13
2047.90
6
-1006.37
2047.90
7
-1190.70
1796.55
8
-1190.70
-1797.65
9
-1023.69
-2049.00
10
-878.45
-2049.00
11
-730.05
-2049.00
12
-584.79
-2049.00
13
-438.69
-2049.00
14S-1
-293.69
-2049.00
14S-2
-152.23
-2049.00
15
-9.22
-2049.00
16
437.42
-2049.00
17
582.68
-2049.00
18
730.42
-2049.00
19
875.68
-2049.00
20
1025.65
-2049.00
21
1189.20
-1797.65
22
1188.70
1796.55
23
1025.68
2047.90
24
878.72
2047.90
25
733.48
2047.90
26
586.52
2047.90
27
441.28
2047.90
28S-1
18.40
2047.90
28S-2
-131.73
2047.90
Note: For bare chip form (C.O.B.) applications, the substrate must be connected to VDD or left floating in the PCB layout.


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