W24L011A-15 datasheet(8/10 Pages) WINBOND

Part #	W24L011A-15

Description	128K X 8 High Speed CMOS Static RAM

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Manufacturer	WINBOND [Winbond]

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W24L011A

- 8 -

PACKAGE DIMENSIONS

32-pin SOJ (300 mil)

D

H

B

b

e

1

16

17

32

E

Y

A

Seating Plane

c

L

S

θ

Symbol

Dimension in mm

Dimension in Inches

Min.

Nom.

Max.

Min.

Nom.

Max.

A

B

b

c

D

E

e

H

L

S

Y

0.140

0.020

0.095

0.100

0.105

0.032

0.028

0.026

0.022

0.018

0.016

0.014

0.010

0.008

0.835

0.825

0.305

0.300

0.295

0.056

0.050

0.044

0.287

0.267

0.247

0.345

0.335

0.325

0.080

0.045

0.004

0

10

0.815

3.556

0.508

2.413

2.540

2.667

0.813

0.711

0.660

0.559

0.457

0.406

0.356

0.254

0.203

21.209

20.955

7.747

7.620

7.493

1.422

1.270

1.118

7.290

6.782

6.274

8.763

8.509

8.255

2.032

1.143

0.102

0°

10°

20.701

θ

__

1

2

1

e

1

2

1

32-pin SOJ (400 mil)

1. Dimension D Max & S include mold flash

or tie bar burrs.

2. Dimension b does not include dambar

protrusion/intrusion.

4. Controlling dimension: Inches

5. General appearance spec. should be based

on final visual inspection spec.

0.28

0.15

0.011

0.006

Notes:

Symbol

Min. Nom. Max.

Max.

Nom.

Min.

Dimension in inches

Dimension in mm

A

b

c

D

e

HE

L

y

A

S

1

2

E

0.145

3.68

0.025

0.105

0.016

0.110

0.115

0.020

2.67

0.41

0.635

2.79

2.91

0.51

0.082

0.004

-5

6

0.825

0.830

2.08

20.96 21.08

0.37

9.40

0.10

10.29

10.16

10.03

0.405

0.400

0.395

11.05

11.18

11.31

0.435 0.440

0.445

3. Dimension D & E include mold mismatch

and are determined at the mold parting line.

e

b 1

0.044 0.050

0.056

1.12

1.27

1.42

0.045

1.14

D

Seating Plane

s

b

b 1

1

32

e

1

A

y

A 2

A

L

1

e

16

17

E

H

c

3.51

3.33

0.138

0.131

0.026 0.028

0.032

0.66

0.71

0.81

0.820

20.83

0.018

0.46

0.008

0.20

0.360

0.380

9.15

9.65

-5

6

2

θ

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