MAX97200AEWC+ datasheet(10/13 Pages) MAXIM

Part #	MAX97200AEWC+

Description	Low-Power, Low-Offset, Dual Mode, Class H DirectDrive Headphone Amplifier

Download	13 Pages

Scroll/Zoom	100%

Manufacturer	MAXIM [Maxim Integrated Products]

Direct Link	https://www.maximintegrated.com/en.html

Logo

10 / 13 page

Low-Power, Low-Offset, Dual Mode, Class H

DirectDrive Headphone Amplifier

10

RIN is the amplifier’s input resistance value. Choose CIN

such that f-3dB is well below the lowest frequency of

interest. Setting f-3dB too high affects the amplifier’s low

frequency. Capacitors with higher voltage coefficients,

such as ceramics, result in increased distortion at low

frequencies.

Charge-Pump Capacitor Selection

Use capacitors with an ESR less than 100mI for opti-

mum performance. Low ESR ceramic capacitors mini-

mize the output resistance of the charge pump. For best

performance over the extended temperature range,

select capacitors with an X7R dielectric.

Flying Capacitor (C1)

The value of the flying capacitor (C1) affects the load

regulation and output resistance of the charge pump. A

C1 value that is too small degrades the device’s ability

to provide sufficient current drive, which leads to a loss

of output voltage. Connect a 1FF capacitor between C1P

and C1N.

Output Capacitors (C2, C3)

The output capacitor value and ESR directly affect the

ripple at PVSS. Increasing the value of C2 and C3 reduc-

es output ripple. Likewise, decreasing the ESR of C2 and

C3 reduces both ripple and output resistance. Lower

capacitance values can be used in systems with low

maximum output power levels. Connect a 1FF capaci-

tor between PVDD and PGND. Connect a 1FF capacitor

between PVSS and PGND.

RF Susceptibility

Improvements to both layout and component selec-

tion can decrease the MAX97200 susceptibility to RF

noise and prevent RF signals from being demodulated

into audible noise. Trace lengths should be kept below

¼ of the wavelength of the RF frequency of interest.

Minimizing the trace lengths prevents the traces from

functioning as antennas and coupling RF signals into the

MAX97200. The wavelength (λ) in meters is given by:

λ

= c/f

where c = 3 x 108 m/s, and f is the RF frequency of

interest.

Route audio signals to the middle layers of the PCB to

allow the ground planes above and below to shield them

from RF interference. Ideally, the top and bottom layers

of the PCB should primarily be ground planes to create

effective shielding.

Additional RF immunity can also be obtained from rely-

ing on the self-resonant frequency of capacitors as

it exhibits the frequency response similar to a notch

filter. Depending on the manufacturer, 10pF to 20pF

capacitors typically exhibit self resonance at RF frequen-

cies. These capacitors when placed at the input pins

can effectively shunt the RF noise at the inputs of the

MAX97200. For these capacitors to be effective, provide

a low-impedance, low-inductance path from the capaci-

tors to the ground plane. Do not use microvias to con-

nect to the ground plane as these vias do not conduct

well at RF frequencies. Figure 3 shows headphone RF

immunity with a well laid out PCB.

Layout and Grounding

Proper layout and grounding are essential for optimum

performance. Use large traces for the power-supply

inputs and amplifier outputs to minimize losses due to

parasitic trace resistance, as well as route heat away

from the device. Good grounding improves audio per-

formance, minimizes crosstalk between channels, and

prevents switching noise from coupling into the audio

signal. Connect PGND and GND together at a single

point on the PCB. Route PGND and all traces that carry

switching transients away from GND, and the traces and

components in the audio signal path.

Connect C2 to the PGND plane. Place the charge-pump

capacitors (C1, C2) as close as possible to the device.

Bypass PVDD with a 1FF capacitor to PGND. Place the

bypass capacitors as close as possible to the device.

Figure 3. Headphone RF Immunity

HEADPHONE RF IMMUNITY

vs. FREQUENCY

FREQUENCY (MHz)

2500

2000

1500

-90

-80

-70

-60

-50

-40

-30

-20

-10

0

-100

1000

3000

LEFT CHANNEL

RIGHT CHANNEL

Similar Part No. - MAX97200AEWC+

Manufacturer	Part #	Datasheet	Description
Maxim Integrated Produc...	MAX97200AEWC++	2Mb / 13P	Low-Power, Low-Offset, Dual Mode, Class H DirectDrive Headphone Amplifier Rev 1; 3/10

More results

Similar Description - MAX97200AEWC+

Manufacturer	Part #	Datasheet	Description
Maxim Integrated Produc...	MAX97200	2Mb / 13P	Low-Power, Low-Offset, Dual Mode, Class H DirectDrive Headphone Amplifier Rev 1; 3/10
	MAX97200	1Mb / 13P	Low-Power, Low-Offset, Dual Mode, Class H DirectDrive Headphone Amplifier Rev 2; 3/11
	MAX9725	528Kb / 19P	1V, Low-Power, DirectDrive, Stereo Headphone Amplifier with Shutdown Rev 2; 11/07
	MAX9725DETC	332Kb / 17P	1V, Low-Power, DirectDrive, Stereo Headphone Amplifier with Shutdown Rev 4; 3/09
	MAX9725	332Kb / 17P	1V, Low-Power, DirectDrive, Stereo Headphone Amplifier with Shutdown 19-3465; Rev 4; 3/09
	MAX9725	425Kb / 14P	1V, Low-Power, DirectDrive, Stereo Headphone Amplifier with Shutdown Rev 0; 11/04
Analog Devices	OP200AZ	329Kb / 16P	Dual Low Offset, Low Power Operational Amplifier Rev. E
	OP-200	602Kb / 10P	DUAL LOW OFFSET, LOW POWER OPERATIONAL AMPLIFIER
	OP200	393Kb / 12P	Dual Low Offset, Low Power Operational Amplifier REV. B
	5962-8859301MPA	329Kb / 16P	Dual Low Offset, Low Power Operational Amplifier Rev. E

More results

MAX97200AEWC+ Datasheet(PDF) 10 Page - Maxim Integrated Products

MAX97200AEWC+ Datasheet(HTML) 10 Page - Maxim Integrated Products

Similar Part No. - MAX97200AEWC+

Similar Description - MAX97200AEWC+

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13

Datasheet Download

Link URL