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2N7002-7-F Datasheet(PDF) 3 Page - Intersil Corporation |
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2N7002-7-F Datasheet(HTML) 3 Page - Intersil Corporation |
3 / 9 page Application Note 1793 3 AN1793.1 December 6, 2012 However, if the output voltage is increased or the board is operated at elevated temperatures, then the available current is derated. Refer to the derated current curves in the datasheet to determine the output current available. For layout of designs using the ISL8225M, the thermal performance can be improved by adhering to the following design tips: 1. Use the top and bottom layers to carry the large current. VOUT1, VOUT2, Phase 1, Phase 2, PGND, VIN1 and VIN2 should have large, solid planes. Place enough thermal vias to connect the power planes in different layers under and around the module. 2. Phase 1 and Phase 2 pads are switching nodes that generate switching noise. Keep these pads under the module. For noise-sensitive applications, it is recommended to keep phase pads only on the top and inner layers of the PCB; do not place phase pads exposed to the outside on the bottom layer of the PCB. To improve the thermal performance, the phase pads can be extended in the inner layer, as shown in Phase 1 and Phase 2 pads on layer 2 (Figure 5) for this dual 15A evaluation board. Make sure that layer 1 and layer 3 have the GND layers to cover the extended areas of phase pads at layer 2 to avoid noise coupling. 3. Place the modules evenly on the board and leave enough space between modules. If the board space is limited, try to put the modules with low power loss closely together (i.e. low VOUT or IOUT) while still separating the module with high power loss. 4. If the ambient temperature is high or the board space is limited, airflow is needed to dissipate more heat from the modules. A heat sink can also be applied to the top side of the module to further improve the thermal performance (heat sink recommendation: Aavid Thermalloy, part number 375424B00034G, www.aavid.com). |
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