Product family data sheet

Copyright © 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice.

Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc.

Product descriPtion

The XLamp XM-L2 LeD builds on

the unprecedented performance of

the original XM-L, increasing lumen

output up to 20% while providing

a single die LeD point source for

precise optical control. The XM-L2

LeD shares the same mechanical

and optical footprint as the original

XM-L, providing a seamless upgrade

path and shortened design cycle.

XLamp XM-L2 LeDs are the ideal

choice

for

lighting

applications

where

high

light

output

and

maximum efficacy are required,

such as LeD light bulbs, outdoor

lighting, portable lighting, indoor

lighting and solar-powered lighting.

features

• Available in white, 80-CRI white,

85-CRI white and 90-CRI white

• ANSI-compatible chromaticity

bins

• Binned at 85 °C

• Maximum drive current:

3000 mA

• Low thermal resistance:

2.5 °C/W

• Wide viewing angle: 125°

• Unlimited floor life at

≤ 30 ºC/85% RH

• Reflow solderable - JEDEC

J-STD-020C

• electrically neutral thermal path

Cree, Inc.

4600 Silicon Drive

Durham, NC 27703

USA Tel: +1.919.313.5300

www.cree.com/xlamp

Cree, Inc.

4600 Silicon Drive

Durham, NC 27703

USA Tel: +1.919.313.5300

table of contents

Flux Characteristics.................... 2

Characteristics .......................... 3

Relative Spectral Power

Distribution............................... 3

Relative Flux vs. Junction

Temperature ............................. 4

electrical Characteristics............. 4

Thermal Design......................... 5

Relative Flux vs. Current ........... 5

Relative Chromaticity vs. Current. 6

Relative Chromaticity vs.

Temperature ............................. 6

Typical Spatial Distribution.......... 7

Reflow Soldering Characteristics .. 8

Notes....................................... 9

Mechanical Dimensions..............10

Tape and Reel ..........................11

Packaging................................12