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TQP7M9104 Datasheet(PDF) 5 Page - TriQuint Semiconductor |
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TQP7M9104 Datasheet(HTML) 5 Page - TriQuint Semiconductor |
5 / 13 page TQP7M9104 2W High Linearity Amplifier Data Sheet: Rev H 09/24/12 - 5 of 13- Disclaimer: Subject to change without notice © 2012 TriQuint Semiconductor, Inc. Connecting the Digital World to the Global Network ® Application Circuit 920-960 MHz (TQP7M9104-PCB900) C11 C10 R2 C9 C1 C7 C15 C3 U1 C17 C13 C14 1 2 3 4 5 6 GND/NC 18 17 16 15 14 13 RFout RFout RFout GND/NC Iref Vbias GND/NC GND/NC RFin RFin GND/NC U1 C10 22 pF R2 51 J2 RF Input C9 2.7 pF C8 6.8 pF J3 RF Output C2 8.2 pF C3 4.7 pF C7 10 uF 6032 C15 100 pF L1 18 nH 0805 B1 0 C1 100 pF C17 1000 pF L3 0 R1 33 nH 0603 C13 0.1 uF R7 110 C14 100 pF L4 0 R3 0 R6 220 C11 100 pF L5 6.8 nH Vcc +5V D3 SM05T1G Bill of Material Ref Des Value Description Manuf. Part Number n/a n/a Printed Circuit Board TriQuint 1078282 n/a n/a Printed Circuit Board TriQuint 1078282 D3 n/a Zener, dual, SOT-23 various C9 2.7 pF Capacitor, Chip, 0603, ±0.05pF, 50 V, Accu-P AVX 06035J2R7ABSTR B1, L3, L4, R3 0 Ω Resistor, Chip, 0603, 5%, 1/16W various L5 6.8 nH Inductor, 0603, 5% Toko LL1608-FSL6N8 C3 4.7 pF Capacitor, Chip, 0603, ±0.05pF, 50 V, Accu-P AVX 06035J4R7ABSTR C2, C8 8.2 pF Capacitor, Chip, 0603, ±0.05pF, 50 V, Accu-P AVX 06035J8R2ABSTR C10 22 pF Capacitor, Chip, 0603, 5%, 50 V, NPO/COG various C1, C11, C14, C15 100 pF Capacitor, Chip, 0603, 5%, 50V, NPO/COG various L1 18 nH Inductor, 1008, 5%, Coilcraft CS Series Coilcraft 1008HQ-18NXJL C17 1000 pF Capacitor, Chip, 0603, 10%, 50V, NPO/COG various C13 0.1 uF Capacitor, Chip, 0603, 50V, X5R, 10% various C7 10 uF Capacitor , Tantalum, 6032, 35V, 10% various R2 51 Ω Resistor, Chip, 0603, 5%, 1/16W various R6 220 Ω Resistor, Chip, 0603, 1%, 1/16W various R7 110 Ω Resistor, Chip, 0603, 1%, 1/16W various R1 33 nH Inductor, 0603, 5% Toko LL1608-FSL33N R8, R4, C12, C4,D3 n/a Do Not Place Notes: 1. See PC Board Layout under Application Information section for more information. 2. Components shown on the silkscreen but not on the schematic are not used. 3. 0 Ω resistors may be replaced with copper trace in the target application layout. 4. Iref can be used as device power down current by placing R7 at location R8. 5. The recommended component values are dependent upon the frequency of operation. 6. All components are of 0603 size unless stated on the schematic. 7. R1 is critical for device linearity performance. 8. Critical component placement locations: Distance between center of C8 and U1 device package is 190 mil (9.2° at 940MHz) Distance between center of L5 and U1 device package is 452 mil (21.8° at 940MHz) Distance between center of C2 and U1 device package is 305 mil (14.7° at 940MHz) Distance between center of C9 and U1 device package is 275 mil (13.3° at 940MHz) |
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